Advanced inspection system featuring intuitive operation and cutting-edge imaging technology for precise conformal coating analysis.
Key Features
Simple and clear user interface designed for ease of use
Self-developed gerber editor with straightforward programming
Unified interface displaying all common functions
Eliminates multiple interface switching for streamlined workflow
Suitable for operators of any skill level
Advanced Imaging Technology
True Color Three-Dimensional Imaging
While conventional SPI systems typically calculate height above screen print, Pemtron's patented Colorxy technology enables easy distinction of copper foil, ensuring accurate zero datum identification. The true color 3D image can be viewed from any angle, providing users with clear, vivid visualization of solder paste patterns and eliminating the need for repeated microscope confirmation.