PARMI SPI HS60XXL SOLDER PASTE INSPECTOR

Key Features of PARMI SPI HS60 and Related Models
1. Advanced Inspection Technology:

3D Laser Triangulation Sensor: Provides robust 3D data and profiles the real shape of features, offering high accuracy against variations in materials and surface conditions.

Dual Laser Projection: Eliminates shadow effects, allowing for precise measurement of components, even those with significant height differences.

2. Real-Time Warpage Tracking:

Accurately measures PCB warpage up to ±5mm using real-time Z-axis control and scanning.

3. Component Inspection:

Can inspect components up to 65mm in height using a multi-step scanning method, providing industry-leading height measurement capabilities.

4. User Interface and Control:

Features a user-friendly interface with graphical windows for easy operation and setup.

Supports remote management of multiple SPI systems, reducing manpower needs while maintaining consistent quality.

5. Inspection Speed and Resolution:

Models like the HS60 Supreme offer inspection speeds of 100cm²/sec at resolutions of 13x13μm. However, specific speeds for the HS60XXL are not detailed.

6. Material Compatibility:

PARMI's inspection technology is compatible with various materials and surface conditions, unaffected by color or material variations.