PARMI HS60XXL Solder Paste Inspector with 3D Laser Triangulation Sensor, Real-Time Warpage Tracking, and 65mm Component Inspection

• 3D Laser Triangulation Sensor Provides robust 3D data and profiles the real shape of features, offering high accuracy against variations in materials and surface conditions.
• Dual Laser Projection Eliminates shadow effects, allowing for precise measurement of components, even those with significant height differences.

Accurately measures PCB warpage up to ±5mm using real-time Z-axis control and scanning.

Can inspect components up to 65mm in height using a multi-step scanning method, providing industry-leading height measurement capabilities.

• Features a user-friendly interface with graphical windows for easy operation and setup.
• Supports remote management of multiple SPI systems, reducing manpower needs while maintaining consistent quality.

Models like the HS60 Supreme offer inspection speeds of 100cm²/sec at resolutions of 13x13μm.

PARMI's inspection technology is compatible with various materials and surface conditions, unaffected by color or material variations.