Advanced automated optical inspection system designed for PCB thickness range of 0.6-6mm, featuring double-sided telecentric lens technology for superior inspection accuracy.
Key Features
Strong generalization capability with high detection rate and low false alarm rate
End-to-end cloud connectivity with remote management support
MES system compatibility with offline operation and online non-stop debugging
Zero missing reports with 40+ cutting-edge AI model strategies
False detection rate <1% with reliable AI technology reducing algorithm misjudgment
Programming time <1 minute with true one-click programming capability
1 millisecond algorithm inference with greatly improved processing speed
Advanced Detection Capabilities
Device-independent intelligent detection system capable of identifying components not included in CAD data through global characteristic learning and intelligent decision indicator generation.
Normalizes multiple complex defect detection thresholds into simple tolerance adjustments without requiring detailed device descriptions. Provides quantitative threshold adjustment suggestions through statistical data analysis.
Technical Specifications
PCB Thickness Range
0.6-6mm
False Detection Rate
<1%
Programming Time
<1 minute
Algorithm Inference
1 millisecond
Operational Benefits
Minimal technical requirements for programming personnel with immediate on-the-job replacement capability, ensuring continuous operational efficiency.