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Relentless Pick-and-Place Dispensing Machine with 560 X 610 Mm Max PCB Dimensions and 11’200 CPH Placement Speed for Modular PCB Assembly

Relentless Pick-and-Place Dispensing Machine with 560 X 610 Mm Max PCB Dimensions and 11’200 CPH Placement Speed for Modular PCB Assembly

RELENTLESS PICK-AND-PLACE DISPENSING Mahcine

Accurate Placement PICK-AND-PLACE DISPENSING Mahcine

Place of Origin:

Germany

Brand Name:

ESSEMTEC

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Product Details
Optimum Placement Speed:
11’200 Cph (2-axes)
Optimum Jetting Speed:
Valve Performance 720’000 - System Ø 260’000 Dots/h
Feeder Capacity 8 Mm Tape:
260 (140 Inline)
Component Size Range:
008004 (imp.) - 109 X 87 Mm
Placement Accuracy (x, Y):
Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ)
Max. PCB Dimensions:
560 X 610 Mm (22 X 24“) Optional 1’800 X 610 Mm (71 X 24“)
Machine Footprint:
1’557 X 1’357 Mm (61 X 53“)
Condition:
Used Original
Highlight:

RELENTLESS PICK-AND-PLACE DISPENSING Mahcine

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Accurate Placement PICK-AND-PLACE DISPENSING Mahcine

Payment & Shipping Terms
Minimum Order Quantity
1 PCS
Price
USD+negotiable+pcs
Packaging Details
1600*1500*1450mm
Delivery Time
1-7 days
Payment Terms
T/T
Supply Ability
1+pcs+per days
Product Description
RELENTLESS PICK-AND-PLACE DISPENSING MACHINE
Maximum PCB Dimensions: 560 * 610 mm (22 * 24")
Introducing the P-u-ma – State-of-the-art technology designed for exceptional accuracy and placement precision. This highly adaptable system is engineered to grow synchronously with your evolving performance and process requirements.
The P-u-ma represents the world's premier high-speed Pick-and-Place solution, offering unparalleled flexibility for rapid prototyping and development applications.
System Features & Capabilities
  • Modular and adaptive design for diverse manufacturing environments
  • Expandable configuration to match growing production demands
  • Ultra-flexible operation ideal for rapid prototyping
  • High-speed precision placement technology
  • Scalable performance to meet evolving process requirements
Maximum PCB Size 560 * 610 mm (22 * 24 inches)
Technology High-Speed Pick-and-Place Dispensing
System Type Modular, Expandable Platform
Primary Application Rapid Prototyping & Manufacturing

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