L 50 X W 50 To L 350 X W 300 (Max. Dimensions Of 1 To 2 Spec : L 350 X W 165)
PCB Exchange Time:
10.0 S Including Transfer, Positioning, Recognition, Each-time Cleaning.Printing & Cleaning Conditions : Our Recommended Conditions (PCB Dimensions L 250 X W 165 ) * Except 1 To 2 Spec
Repeatability:
2 Cpk ± 5.0 μm 6 σ The Repeatability Of Same PCB;Equal To ± 5.0 μm ± 3 σ (or ±2.5 μm ±1.5 σ)
Screen Frame Dimensions (mm):
L 736 X W 736, L 650 X W 550, L 550 X W 650, L 750 X W 750, L 584 X W 584*2
Engineered for speed without compromising accuracy. Advanced printing head and stencil alignment system ensure rapid operation, ideal for high-throughput production lines.
Precision Alignment
Cutting-edge vision system delivers highly accurate stencil alignment, ensuring precise solder paste placement. Reduces defects such as bridging or insufficient solder.
Advanced Cleaning System
Built-in stencil cleaning system prevents paste residue buildup, maintaining consistent print quality throughout production and preventing errors.
Intuitive Software
User-friendly software simplifies setup, operation, and monitoring. Provides real-time data and analytics to optimize manufacturing processes.
Versatility
Handles various PCB sizes, solder paste types, and stencil designs. Adaptable for dynamic manufacturing environments with changing requirements.