High Speed SMT Placement Machine Module Z:LEX YSM20 With Dual Lane
The Z:LEX YSM20 High-Speed Placement Machine Module represents a significant advancement in surface mount technology (SMT), delivering exceptional speed, precision, and flexibility for modern electronics manufacturing. As part of the YAMAHA YSM20 series, this modular solution is engineered to meet the rigorous demands of high-throughput production environments while offering seamless integration capabilities.
Key Features and Benefits
- High-Speed Mounting: Achieves up to 90,000 components per hour (CPH) with the HM head, significantly boosting production throughput
- Component Flexibility: Handles components from 03015mm to 55 x 55mm, with heights up to 28mm using the Flexible Multi (FM) head
- Precision Accuracy: Mounting accuracy of ±0.035mm (±0.025mm) Cpk≧1.0 (3σ) ensures high-quality placement for dense electronic assemblies
- Advanced Imaging: Wide-scan camera with side lighting enables high-speed recognition of small components and ball electrode parts like CSP and BGA
- Versatile Configuration: Available in single-lane and dual-lane conveyor options with single and dual-stage configurations
- Seamless Integration: Supports SEMI SMT-ELS communication standards and IoT/M2M systems for enhanced production line connectivity
Technical Specifications
| PCB Compatibility |
Single-lane: L810 x W490 to L50 x W50
Dual-stage with X-axis 2-beam: 1PCB conveyance: L810 x W490 to L50 x W50, 2PCB conveyance: L380 x W490 to L50 x W50 |
| Feeder Capacity |
Fixed plate: 140 types (8mm tape feeder conversion)
Feeder carriage exchange: 128 types (8mm tape feeder conversion)
Trays: 30 types (fixed), 10 types (carriage) |
| Power Requirements |
3-Phase AC power supply (200/208/220/240/380/400/416V +/-10% 50/60Hz) |
| Air Supply |
0.45MPa or more, clean and dry state |
| Dimensions |
L 1,374 x W 1,857 x H 1,445mm |
| Weight |
Approximately 2,050kg |
Adaptability and Scalability
The modular design of the YAMAHA YSM20 enables easy customization and expansion to adapt to evolving production requirements. Optional features including FES carts for feeder setup and changeover further enhance operational versatility.
Note: The High-Efficiency Modular Z:LEX YSM20R is now a discontinued product, but remains relevant for existing operations and used equipment considerations.
Frequently Asked Questions
What is the maximum mounting speed of the Z:LEX YSM20?
The Z:LEX YSM20 can achieve a mounting speed of up to 90,000 CPH under optimum conditions with the HM head.
What is the component size range supported by the YAMAHA YSM20?
The YAMAHA YSM20 supports components ranging from 03015mm to 55 x 55mm, and up to 55 x 100 mm depending on the head configuration.
What are the power requirements for the YAMAHA YSM20?
The YAMAHA YSM20 requires a 3-Phase AC power supply (200/208/220/240/380/400/416V +/-10% 50/60Hz).
What PCB sizes can the YAMAHA YSM20 accommodate?
The YAMAHA YSM20 handles single-lane PCBs from L810 x W490 to L50 x W50 and dual-stage PCBs. With the X-axis 2-beam option, it supports 1PCB conveyance: L810 x W490 to L50 x W50 and 2PCB conveyance: L380 x W490 to L50 x W50.
What is a key feature that enhances component recognition?
The wide-scan camera supports high-speed mounting of small components and, with side lighting, enables rapid recognition of ball electrode components like CSP and BGA packages.
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