The MagicRay 3D SPI-VSP3000 series is specifically designed for 3D solder paste inspection following SMT screen printing processes, ensuring superior quality control in electronics manufacturing.
Key Features & Capabilities
Intelligent zero reference point technology ensures precise height measurement accuracy
Advanced detection of solder bridging, solder breakage, icicle formation, and other common defects
Effective performance across PCBs with varying color variations and surface finishes
Automatic solder pad compensation enhances measurement precision for both height and volume
Comprehensive SPC data analysis for continuous process quality improvement
Three Point Checks software enables rapid root cause analysis for excess solder, insufficient paste, and smearing issues