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High Speed Automated X-Ray CT Inspection System with 3D-CT Imaging for Precision Defect Detection

High Speed Automated X-Ray CT Inspection System with 3D-CT Imaging for Precision Defect Detection

X-ray CT inspection system

automated CT inspection system

High speed CT inspection system

Place of Origin:

Japan

Brand Name:

OMRON

Model Number:

VT-X750

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Product Details
Model:
VT-X750
Inspection Object:
BGA/CSP, Inserted Components, SOP, QFP, Transistors, R/C Chips, Bottom-side Terminal Components, QFN, Power Devices, POP, Press-fit CN, Etc
Inspection Items:
Void, Open, Non-wet, Solder Volume, Shifting, Foreign Object, Bridging, Solder Fillet, TH Solder Filling, Solder Ball, Etc. (selectable To Applications)
Imaging System Method:
3D-slice Imaging By Using Parallel CT
Imaging System X-ray Source:
Micro-fucus Closed Tube
Imaging System X-ray Detector:
Flat Panel Detector
PCBA Size:
50x50~610x515mm (2x2 To 24x20 Inch), Thickness:0.4~5.0mm (0.4~3.0mm In 3μm Resolution)
PCBA Weight:
Less Than 4.0 Kg, Less Than 8.0 Kg (*option)
PCBA Component Clearance *Maximum:
Top: 90 Mm (*option), Bottom: 40 Mm
PCBA Warpage:
Less Than 2.0 Mm (Less Than 1.0 mm In 3μm Resolution)
Main Body Footprint:
1,550(W) X 1,925(D) X 1,645(H) Mm
Main Body Weight:
Approx. 3,100kg
Highlight:

X-ray CT inspection system

,

automated CT inspection system

,

High speed CT inspection system

Payment & Shipping Terms
Minimum Order Quantity
1 PCS
Price
USD+negotiable+pcs
Packaging Details
1650*2100*1700mm
Delivery Time
1-7 days
Payment Terms
T/T
Supply Ability
1+pcs+per days
Product Description
High Speed Automated X-Ray CT Inspection System
The VT-X750 is engineered for non-destructive inspection of 5G infrastructure modules, in-vehicle electrical components, and power devices. Utilizing full 3D-CT technology, this system delivers high-definition, high-quality inspection capabilities essential for modern manufacturing applications.
Advanced Inspection Applications
The VT-X750 has been extensively deployed for inspecting solder voids and solder filling of through-hole connectors in power device final assembly, including IGBTs and MOSFETs critical for electric vehicles. This system also serves aerospace, industrial equipment, and semiconductor industries with integrated machine and electric power inspection solutions.
In-line Full Inspection Coverage
Featuring Omron's patented technology, the VT-X750 represents the fastest X-Ray inspection system available. Automated inspection logic has been enhanced for numerous components including IC heel fillets, stacked devices (PoP), through-hole components, press-fit connectors, and bottom-terminated parts.
* Based on internal investigation conducted October 2021. Inspection time measured for M-size substrate PCB inspection excluding load/unload time. Includes 3D inspection of both board sides with 2 BGA components featuring 2,000-3,000 pins or SiP.
Solder Joint Strength Visualization
Omron's proprietary 3D-CT reconstruction algorithms provide exceptional solder shape recognition and defect detection capabilities. Quantitative analysis enables automated inspection processes that minimize escape risks while ensuring fast, repeatable operation.
Design Constraint Flexibility
Dense and dual-sided board designs often present challenges for conventional X-Ray inspection. Omron's 3D-CT technology overcomes these design limitations, providing comprehensive inspection regardless of board complexity.
Automated Criteria Setting
The system's Auto-Judge functionality reduces dependency on dedicated programmers through dynamic analysis using Omron AI. This approach enables quantitative decision-making based on conventional inspection standards for accurate OK/NG judgments. Integrated 3D cross-sectional display functionality simplifies inspection criteria settings.
Rapid Program Development
Omron AI facilitates quick creation of new inspection programs. Combined with automated program generation using CAD data, the system automatically tunes parts libraries using inspection result data for continuous optimization.
Accelerated Production Preparation
Omron AI simulates optimal tact times and exposure dosages for specific parts, automatically determining corresponding conditions for the X-ray inspection process to streamline production setup.
Zero Downtime Operation
Designed for continuous production line operation, Omron provides global support with comprehensive maintenance services including machine monitoring for predictive maintenance and remote access for emergency support.
Radiation Exposure Reduction
High-speed, low-radiation imaging technology incorporates standard filters to minimize radiation exposure effects. Concerns about radiation exposure, particularly to memory components, are significantly reduced through advanced high-speed imaging capabilities.
The integrated parts radiation exposure simulator enables high-accuracy simulation of exposure levels for each component on both top and bottom sides of PCBs.
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