Name: FUJI XPF-W High-Speed SMT Pick and Place Machine with Versatile Component Handling and On-the-Fly Centering for PCB Assembly
Brand: Global Soul Limited
SKU: XPF-W
Availability: InStock

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FUJI XPF-W High-Speed SMT Pick and Place Machine with Versatile Component Handling and On-the-Fly Centering for PCB Assembly

Multi Purpose SMT Pick And Place Machines

PCB SMT Pick And Place Machines

SMT PCB Pick And Place Machine

Place of Origin:

Japan

Brand Name:

FUJI

Model Number:

XPF-W

Document:

Product Brochure PDF

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FUJI XPF-W High-Speed SMT Pick and Place Machine with Versatile Component Handling and On-the-Fly Centering for PCB Assembly

Product Details

Model:

FUJI XPF-W

PCB Size:

L50mm X W50mm To L686mm X W508mm

PCB Thickness:

0.4–6.5mm

PCB Loading Time:

3.5 Sec

External Dimension:

L1500 X W1762.5 X H1422.5mm

Weight:

Approx. 1860kg （without MFU Mounted）

Highlight:

Multi Purpose SMT Pick And Place Machines

PCB SMT Pick And Place Machines

SMT PCB Pick And Place Machine

Payment & Shipping Terms

Minimum Order Quantity

1 pcs

Price

USD+negotiable+pcs

Packaging Details

1800*2000*1650mm

Delivery Time

1-7 days

Payment Terms

T/T

Supply Ability

1+pcs+per days

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Product Description

FUJI XPF-W Multi Purpose SMT Pick And Place Machines For PCB Production

The FUJI XPF-L/W High-speed Multi-Purpose Mounter is a state-of-the-art machine engineered to enhance productivity and flexibility in electronics manufacturing. This advanced system excels in high-speed component placement while maintaining adaptability for diverse surface-mount technology (SMT) applications, making it ideal for modern, complex production environments.

Key Functions

High-Speed Component Placement: Equipped with high-speed heads for rapid and precise placement of components ranging from small chips to larger ICs, optimizing throughput while maintaining accuracy.
Versatile Component Handling: Capable of processing 0201 metric microchips, odd-shaped components, and larger devices like connectors, providing exceptional flexibility for various SMT applications.
On-the-Fly Component Centering: High-precision vision system performs real-time component centering during placement, ensuring accuracy at high speeds and minimizing placement errors.
Multi-Function Head: Single head configuration handles standard components, odd-form parts, and large connectors, eliminating the need for multiple machines or manual intervention.
Automatic Feeder Exchange: Supports automatic feeder exchange with cart swapping capabilities, enabling continuous production and efficient material replenishment.
Flexible PCB Handling: Accommodates wide range of PCB sizes from small boards to complex panels with adjustable conveyor system for various production requirements.
Nozzle Changer System: Automatic nozzle changer stores multiple nozzle types and exchanges them during operation, enhancing productivity and flexibility.
Advanced Software Integration: Seamlessly integrates with FUJI's proprietary software for full machine control, programming, real-time monitoring, and remote diagnostics.
Non-Stop Operation: Dynamic load balancing distributes work evenly across multiple heads, ensuring continuous operation and preventing bottlenecks.
Hybrid Placement Capability: Supports both chip shooting and fine-pitch placement in one unit, reducing the need for multiple machines in production lines.

Key Features

Compact Design: Space-efficient footprint suitable for factories with limited space, easily integrated into existing production lines.
High Precision and Accuracy: Advanced motion control systems and precision placement heads ensure exceptional accuracy for high-density boards.
Scalable for High Mix/Low Volume: Fast setup times and automatic changeover functions ideal for environments with frequent product changes.
Wide Component Size Range: Handles components from 0201 microchips to large ICs and connectors for comprehensive PCB assembly solutions.
User-Friendly Interface: Intuitive, easy-to-navigate interface simplifies setup, operation, and real-time performance monitoring.
Energy-Efficient Design: Incorporates energy-efficient technologies to reduce power consumption and operating costs.
Built-in Error Detection: Advanced error detection systems identify and correct misplacements, minimizing rework and reducing waste.
Modular Design: Modular structure enables easy maintenance and upgrades with quick component replacement capabilities.
Wide Operating Range: Robust design ensures consistent performance across various production environments and board types.
Industry Standards Compliance: Meets latest industry standards for SMT equipment including quality control, precision, and safety requirements.

The FUJI XPF-L/W High-speed Multi-Purpose Mounter represents a comprehensive solution for electronics manufacturers seeking to optimize SMT processes, reduce downtime, and improve overall productivity. Its combination of speed, precision, and versatility makes it suitable for both high-volume production and frequently changing product lines.

Tags：

SMT Cooling Temporary Storage Machine with 130℃ to 30℃/60s Cooling Range and 100011001300mm Size for 5050-550350mm PCB Boards

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FUJI XPF-W High-Speed SMT Pick and Place Machine with Versatile Component Handling and On-the-Fly Centering for PCB Assembly

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