quality SMT Machine Parts & SMT Placement Machine factory

Daily, weekly and monthly maintenance of reflow soldering Reflow daily maintenance content: (1) Check whether there is grease in the transmission chain, and add grease in time if necessary. (2) Check that there is no running edge in the transport network, and notify HB in time if there is running edge. (3) Check the reflow furnace inlet mesh belt drive wheel is not shifted, if there is a shift can be adjusted by loosening the screw - adjusting - locking the screw step. (4) Check whether the net belt drive roller at the outlet of reflow furnace is loose, if it is loose, it can be adjusted according to the steps of loosening the screws - adjusting - locking screws. (5) Check whether the high temperature oil in the oil cup is appropriate, the oil surface should be 5mm from the mouth of the cup, if necessary, add high temperature oil in time. Reflow maintenance content: (1) Check the surface of the transport network belt for dirt adhesion, if there is loot adhesion in time with alcohol scrub. (2) Check the guide rail chain groove for foreign bodies, if there are foreign bodies in time to remove the chain with alcohol scrub. (3) Check whether the bearings of the driven gear of the transport chain are flexible, and add lubricating oil in time when necessary. (5) Check whether there is grease on the surface of the lead rod of the head component and no foreign matter, wipe it clean in time when necessary, and add grease. (6) Check whether there is FLUX and dust on the rectifier plate in each area of the furnace, and clean it with alcohol in time if there is dust. (7) Check whether the lifting motor of the furnace lifting system is running without vibration and noise, if there is vibration or noise, it should be replaced in time (8) Check whether the filter of the exhaust device is blocked, if there is blockage, alcohol should be used to clean. (9) Check whether there is FLUX adsorption on the rectifier plate in the cooling area of the cooling system. If there is FLUX, it should be cleaned with alcohol in time. (10) Check that the surface of the photoelectric switch at the transport entrance has dust-free accumulation. If there is dust accumulation, it should be wiped clean with a soft dry rag in time. (11) Check whether the surface of the PC and UPS is clean. If there is dust accumulation, it should be wiped with a soft dry cloth in time. Monthly maintenance contents of reflow welding: (1) Check whether there is vibration and noise in the transportation process, and notify HB in time if necessary. (2) Check whether the transport motor fixing screw is loose, if it is loose, lock the screw. (3) Check whether the tension of the transmission chain is appropriate, and adjust the motor positioning screw in time if necessary. (4) Check whether there is coke and black powder on the transport chain, if there is, it should be removed in time and cleaned with diesel oil. (5) Check the positioning of the synchronous shaft of the width adjustment in the track of the active end, and whether the fixed block is loose. If it is loose, it should be locked in time. (6) Check whether the hot air motor positioning screw is loose, if loose, it should be locked in time. (7) Check whether there is dust and foreign matter in the control box of the electrical system. If there is foreign matter, blow out dust and foreign matter with the same pressure air after power off.

What external environmental factors will affect the first SMT tester As a high-precision precision instrument, any small external factors may bring measurement accuracy errors, then which external factors have a greater impact on the instrument, should be understood and paid attention to? The following Xiaobian to give you a detailed introduction. 1. Ambient temperature As we all know, temperature is the main factor in the measurement accuracy of the first tester, because the first tester is a precision instrument, so some of the production materials will be affected by thermal expansion and contraction, such as grating ruler, marble and other parts. Generally, there are strict requirements for the measurement of temperature, and the temperature is generally floating two degrees above and below 20 ° C, and there will be some changes in the accuracy beyond this range. Therefore, the machine room using the first tester must be equipped with air conditioning, and pay attention to the use of air conditioning. An air conditioner should be able to turn on 24 hours, otherwise try to ensure that it is on within 8 hours of work; Second, ensure that the first tester is used under constant temperature conditions, and then measure after the temperature of the machine room is stable; Three air conditioning mouth do not blow against the instrument. Second, environmental humidity Many companies may not pay attention to the impact of humidity on the first tester, because the instrument has a large range of acceptable humidity, and the general humidity can be between 45% and 75%. However, it should be noted that many parts of precision instruments are easy to rust, and once rust will greatly cause precision error. Therefore, pay attention to air humidity control and try to keep the equipment in a more suitable humidity environment. Pay attention especially during the rainy season or in areas that are already wet. Production of SMT first tester 3. Environmental vibration Vibration is a common problem for the first tester, and it is difficult to avoid air compressors, presses and other heavy equipment with large vibrations. Attention should be paid to controlling the distance between these vibration sources and the first tester. There are also some small amplitude vibration sources that need attention, and if the small amplitude is close to the vibration frequency of the first tester, it is a very serious problem. However, enterprises generally install shockproof equipment on the first tester, so as to reduce the interference of vibration on the first tester and improve the measurement accuracy. 4. Environmental health The first tester this precision instrument has high environmental health requirements, if the health is poor, dust and dirty things will be left on the first tester and measurement workpiece, which will lead to measurement errors. Especially in the working machine room there are some oil, coolant, etc., be careful not to let these liquids stick to the workpiece. Usually pay attention to cleaning the machine room health, in and out of the personnel should also pay attention to health, to wear clean clothes, in and out to change shoes, reduce the outside dust oil stains into the machine room. 5. Other external factors There are also many external factors that may affect the measurement accuracy of the first tester, such as the power supply voltage, etc., the first tester needs a stable voltage when working, and the general enterprise will install equipment to control the voltage, similar to a regulator to control the voltage. The above content is the introduction of what external environmental factors affect the first tester, the first tester is based on the CCD digital image, relying on the computer screen measurement technology and the powerful software ability of space geometry. After the computer is installed with the special control and graphic measurement software, it becomes the measurement brain with the software soul, which is the main body of the whole device. Efficiency Technology SMT intelligent first detector is a high-tech product independently developed and designed by Efficiency Technology company with independent intellectual property rights. It is an innovative solution for SMT first part confirmation to achieve efficiency reduction.

What is the significance of SMT first tester for enterprises In today's society, all kinds of electrical appliances are filled in all aspects of our lives, and people are increasingly relying on these electronic products, especially digital products and smart phones, which are a typical example. The production of these products cannot be separated from the core component - the circuit board. Because the demand for electrical appliances continues to rise, the production of PCB SMT electronics factory also continues to increase. The increase of production enterprises will inevitably bring greater competitive pressure, and only in the hands of many competitors, can enterprises survive and grow. In today's increasing competition, the rapid development of an enterprise cannot be separated from efficient work efficiency, that is, the work efficiency of employees can not be ignored. And an important factor that affects the work efficiency of employees is the quality of equipment. This requires enterprises to pay a certain cost to buy equipment. For example, the emerging SMT first tester, many companies do not think there is a need to buy, because only manual can complete the work, and then pay an additional cost is not cost-effective. However, as long as you understand this product in detail, you can know that the benefits that SMT intelligent first part tester can bring to the enterprise are in all aspects. smt first tester company First, the SMT first tester only needs one inspector to operate, the enterprise saves labor costs, and the operation of the SMT first tester is not complicated, and the inspector can quickly get familiar with it; Second, the speed of the first detection is improved, and the average detection of a component can be 3 seconds, further speeding up the production progress; Third, the high accuracy of the first detection can find the problem as early as possible, so as to solve the problem; Fourthly, the detection report is automatically generated, and the report is paperless to avoid accidents in data preservation. At the same time, standardized reports can bring better reading experience and enhance customers' impression of enterprise management; Fifth, the first detector can be connected with the enterprise's current ERP or MES system. In traditional SMT first detection, inspectors are often only equipped with multimeters, capacitance meters, magnifying glasses, and such simple equipment can be used in the case of fewer components, but once there are slightly more components, because of the limitations of the equipment, the energy of the staff is limited, and the difficulty of detection increases sharply. In the case of increased difficulty, the increase in detection time and error rate is inevitable. Under the current flow operation mode, the abnormal occurrence of the first detection will inevitably affect the operation of the entire production line. Especially in the case of frequent wire change, each change must be carried out a first piece detection, at this time the detection efficiency will more affect the production. There are many defects in the traditional manual SMT first detection, and the following detection report is a headache, and the manual report format is chaotic and data errors often occur. The first piece of detector will not appear such a situation, the system automatically collects test data to avoid various errors that occur when manual recording. After the test is completed, the system automatically generates the report, and can export the report in Excle format, which is very convenient for audit.

Why is SMT first Part tester so important for first part testing in SMT processing plants First of all, we need to know what are the factors that affect production efficiency in the production process? Affecting efficiency That must be the first confirmation process. A product with a low number of first pieces takes half an hour for first piece confirmation. A production model with many credits can take an hour, two hours, or even three hours to complete the first part confirmation process. In the current production process, such a first confirmation speed is far from meeting our production needs. How can we speed up our first confirmation? SMT intelligent first piece detector is a piece of detection instrument specifically for SMT first piece detection, through the combination of coordinates and BOM, as well as the display of high-definition pictures, directly reflect the material information of each position, do not need to query, operation directly by the operator to pick up the system prompts after the system automatically determines the detection result. This means of operation is simple, convenient and fast. Greatly improve the speed of your first confirmation, improve your production efficiency. How to ensure the quality of production? How do the problems of production quality come about? The more reason is that human operation is improper. Most of the time, we need to manually screen and delete the information given to us by customers, and the artificial operation will easily lead to wrong information, so that the wrong information is not detected in the process of the first detection. Lead to quality problems. The first detector does not require you to carry out redundant operations, and does not require you to go to the position information one by one. The data used by the first detector is generally required to be the original information provided by the customer, which comes from the customer, that is, the production form that the customer wants you to process. Therefore, when your first test is completed, the information is qualified, then, the product you produce now is the product that the customer requires to produce, so how can the quality not pass? Moreover, when your first piece detection is completed, the device can help you generate a first piece report, and you basically understand the process of the first piece operation when you watch the report. SMT first tester manufacturers What are the advantages of SMT first piece detector? SMT first piece detector can improve production efficiency, reduce labor costs, automatically judge test results, improve product quality, with traceability, strict process specifications, scan the SMT first piece PCB that needs to be tested, smart frame to obtain PCB physical scan picture, import BOM list and PCB component patch coordinates. The software intelligent synthesis and intelligent global coordinate calibration of PCB pictures, BOM and coordinates, so that the component coordinates, BOM and picture physical component position correspond one by one. By measuring the target through navigation, LCR reads the data to automatically correspond to the corresponding position and automatically judge the detection result. Avoid false test and leakage test, and automatically generate test reports stored in the database. After the continuous upgrading and improvement of the software, the system can also be applied to patch the missing parts of the material and realize the coordinate function of the coordinate meter to obtain the position coordinates of the chip components for the PCB.

What does the SMT manufacturing shop in the electronics factory do?Some workers who entered the electronics factory for the first time heard that they were assigned to the SMT manufacturing workshop, so they had a question: what is the SMT workshop? How difficult is the job? Is it dangerous? Are you tired? This article will give you a graphic, easy to understand the introduction of SMT workshop SMT production line and DIP production line. Doubts about SMT workshop Today, Xiaobian will give you a brief introduction to the SMT manufacturing workshop according to the information provided by relevant people in the industry. If you have any questions, you can contact me (my micro-number is hechina168). The SMT workshop in the electronics factory is generally divided into SMT line and DIP line. SMT workshop production line planning SMT refers to Surface assembly Technology (also known as surface mount technology) (is the abbreviation of English Surface Mounted Technology), it is the most popular technology and process in the electronic assembly industry. In simple terms, SMT is to attach electronic components to the PCB board through the equipment, and then heated by the furnace (generally refers to the reflow furnace, also known as the reflow welding furnace), and weld the components to the PCB board through the solder paste. The basic process of SMT is: solder paste printing --> Parts mounting --> reflow welding -->AOI optical inspection --> Maintenance --> sub-board. DIP is the plug-in, DIP pipeline is the plug-in welding pipeline, and some enterprises are also called PTH and THT, which are the same meaning. DIP has some large connectors, the device is not able to hit the PCB board, then it is necessary to plug into the PCB board through people or other automation equipment. The main process of DIP plug-in is: DIP plug-in main process flow SMT line mainly includes solder paste printer, material worker, pre-furnace eye inspection, post-furnace eye inspection, packaging and so on. DIP line mainly includes board casting personnel, plate removal personnel, plug-in personnel, furnace workers, after the furnace welding spot eye inspection. SMT workshop working environment Question 1: Is SMT workshop work harmful to human body? SMT workshops generally need to be ventilated, and employees need to wear overalls and protective gloves during work, because they will be exposed to some chemical agents during work. In the case of good protection, there is no major harm to human health, but if it is allergic, it is necessary to report and test in advance to prevent accidents. SMT workshop staff and wear protective work clothing Question 2: How about SMT work? SMT production line solder paste printing machine, patch machine, reflow welding (such as Haobao automatic lead-free reflow welding machine) and other equipment has been basically automated, the operator is basically standing guard, during the work is able to walk, because the need to take materials and other items. The labor intensity of the post is general, you need to understand some professional knowledge of machine operation, if you take the initiative to learn the maintenance of equipment through your own efforts, then there is also a skill in the future job search, which can be regarded as a technical post.

"Point-and-shoot" operation of the first SMT tester The SMT electronics factory buys the first detection machine to improve the detection efficiency of the first piece and create more profits for the enterprise. Therefore, the sooner the equipment is purchased and put into the production line, the better, and whether the first detection machine can be put into the production line depends on whether the operator has mastered the use of it. SMT first tester brand Operating the first detector only requires the operator to know basic computer operations. That is, the switch of the computer, the mouse keyboard operation, the basic operation of Excle, so the operation of the first machine is very simple, and the operator can master the entire detection process under the guidance of the engineer in only 1 to 3 working days. If you have any questions in the course of subsequent use, you can also contact the engineers of Global Soul Limited for timely remote or on-site resolution. Quality products and quality service are the philosophy of Global Soul Limited.

Reflow welding is divided into main defects, secondary defects and surface defects. Any defect that disables the function of SMA is called a major defect; Secondary defects refer to the wettability between solder joints is good, does not cause the loss of SMA function, but has the effect of product life may be defects; Surface defects are those that do not affect the function and life of the product. It is affected by many parameters, such as solder paste, paste accuracy and welding process. In our SMT process research and production, we know that reasonable surface assembly technology plays a vital role in controlling and improving the quality of SMT products. I. Tin beads in reflow soldering 1. Mechanism of tin bead formation in reflow welding: The tin bead (or solder ball) that appears in reflow welding is often hidden between the side or the fine-spaced pins between the two ends of the rectangular chip element. In the component bonding process, the solder paste is placed between the pin of the chip component and the pad. As the printed board passes through the reflow furnace, the solder paste melts into a liquid. If the liquid solder particles are not well wetted with the pad and the device pin, etc., the liquid solder particles cannot be aggregated into a solder joint. Part of the liquid solder will flow out of the weld and form tin beads. Therefore, the poor wettability of the solder with the pad and the device pin is the root cause of the formation of tin beads. Solder paste in the printing process, due to the offset between the stencil and the pad, if the offset is too large, it will cause the solder paste to flow outside the pad, and it is easy to appear tin beads after heating. The pressure of the Z axis in the mounting process is an important reason for tin beads, which is often not paid attention to. Some attaching machines are positioned according to the thickness of the component because the Z axis head is located according to the thickness of the component, which will cause the component to be attached to the PCB and the tin bud will be extruded to the outside of the welding disc. In this case, the size of the tin bead produced is slightly larger, and the production of the tin bead can usually be prevented by simply re-adjusting the Z-axis height. 2. Cause analysis and control method: There are many reasons for poor solder wettability, the following main analysis and related process related causes and solutions: (1) improper reflux temperature curve setting. The reflux of the solder paste is related to temperature and time, and if sufficient temperature or time is not reached, the solder paste will not reflux. The temperature in the preheating zone rises too fast and the time is too short, so that the water and solvent inside the solder paste are not completely volatilized, and when they reach the reflow temperature zone, the water and solvent boil out the tin beads. Practice has proved that it is ideal to control the temperature rise rate in the preheating zone at 1 ~ 4℃/S. (2) If tin beads always appear in the same position, it is necessary to check the metal template design structure. The corrosion accuracy of the template opening size can not meet the requirements, the size of the pad is too large, and the surface material is soft (such as copper template), which will cause the external outline of the printed solder paste to be unclear and connected to each other, which mostly occurs in the pad printing of fine-pitch devices, and will inevitably cause a large number of tin beads between the pins after reflow. Therefore, suitable template materials and template making process should be selected according to the different shapes and center distances of pad graphics to ensure the printing quality of solder paste. (3) If the time from the patch to reflow soldering is too long, the oxidation of the solder particles in the solder paste will cause the solder paste to not reflow and produce tin beads. Choosing a solder paste with a longer working life (generally at least 4H) will mitigate this effect. (4) In addition, the solder paste misprinted printed board is not sufficiently cleaned, which will cause the solder paste to remain on the surface of the printed board and through the air. Deform the printed solder paste when attaching components before reflow soldering. These are also the causes of tin beads. Therefore, it should accelerate the responsibility of operators and technicians in the production process, strictly comply with the process requirements and operating procedures for production, and strengthen the quality control of the process. two One end of the chip element is welded to the pad, and the other end is tilted up. This phenomenon is called the Manhattan phenomenon. The main reason for this phenomenon is that the two ends of the component are not heated evenly, and the solder paste is melted successively. Uneven heating at both ends of the component will be caused in the following circumstances: (1) The component arrangement direction is not designed correctly. We imagine that there is a reflow limit line across the width of the reflow furnace, which will melt as soon as the solder paste passes through it. One end of the chip rectangular element passes through the reflow limit line first, and the solder paste melts first, and the metal surface of the end of the chip element has liquid surface tension. The other end does not reach the liquid phase temperature of 183 ° C, the solder paste is not melted, and only the bonding force of the flux is far less than the surface tension of the reflow solder paste, so that the end of the unmelted element is upright. Therefore, both ends of the component should be kept to enter the reflow limit line at the same time, so that the solder paste on the two ends of the pad is melted at the same time, forming a balanced liquid surface tension, and keeping the position of the component unchanged. (2) Insufficient preheating of printed circuit components during gas phase welding. The gas phase is the use of inert liquid vapor condensation on the component pin and PCB pad, release heat and melt the solder paste. The gas phase welding is divided into the balance zone and the steam zone, and the welding temperature in the saturated steam zone is as high as 217 ° C. In the production process, we found that if the welding component is not sufficiently preheated, and the temperature change above 100 ° C, the gasification force of the gas phase welding is easy to float the chip component of the package size of less than 1206, resulting in the vertical sheet phenomenon. By preheating the welded component in a high and low temperature box at 145 ~ 150℃ for about 1 ~ 2min, and finally slowly entering the saturated steam area for welding, the phenomenon of sheet standing was eliminated. (3) The impact of pad design quality. If a pair of pad size of the chip element is different or asymmetrical, it will also cause the amount of printed solder paste is inconsistent, the small pad responds quickly to the temperature, and the solder paste on it is easy to melt, the large pad is the opposite, so when the solder paste on the small pad is melted, the component is straightened under the action of the surface tension of the solder paste. The width or gap of the pad is too large, and the sheet standing phenomenon may also occur. The design of pad in strict accordance with the standard specification is the prerequisite to solve the defect. Three. Bridging Bridging is also one of the common defects in SMT production, which can cause short circuits between components and must be repaired when the bridge is encountered. (1) The solder paste quality problem is that the metal content in the solder paste is high, especially after the printing time is too long, the metal content is easy to increase; The viscosity of the solder paste is low, and it flows out of the pad after preheating. Poor slump of solder paste, after preheating to the outside of the pad, will lead to IC pin bridge. (2) The printing system printing press has poor repeat accuracy, uneven alignment, and solder paste printing to copper platinum, which is mostly seen in fine-pitch QFP production; The steel plate alignment is not good and PCB alignment is not good and the steel plate window size/thickness design is not uniform with the PCB pad design alloy coating, resulting in a large amount of solder paste, which will cause bonding. The solution is to adjust the printing press and improve the PCB pad coating layer. (3) The sticking pressure is too large, and the soaking of the solder paste after pressure is a common reason in production, and the Z-axis height should be adjusted. If the accuracy of the patch is not enough, the component is shifted and the IC pin is deformed, it should be improved for the reason. (4) The preheating speed is too fast, and the solvent in the solder paste is too late to volatilize. The core-pulling phenomenon, also known as the core-pulling phenomenon, is one of the common welding defects, which is more common in vapor phase reflow welding. The core suction phenomenon is that the solder is separated from the pad along the pin and the chip body, which will form a serious virtual welding phenomenon. The reason is usually considered to be the large thermal conductivity of the original pin, the rapid temperature rise, so that the solder is preferred to wet the pin, the wetting force between the solder and the pin is much greater than the wetting force between the solder and the pad, and the upwarping of the pin will aggravate the occurrence of the core suction phenomenon. In infrared reflow welding, PCB substrate and solder in the organic flux is an excellent infrared absorption medium, and the pin can partially reflect infrared, in contrast, the solder is preferentially melted, its wetting force with the pad is greater than the wetting between it and the pin, so the solder will rise along the pin, the probability of core suction phenomenon is much smaller. The solution is: in the vapor phase reflow welding, the SMA should be fully preheated first and then put into the vapor phase furnace; The weldability of PCB pad should be carefully checked and guaranteed, and PCB with poor weldability should not be applied and produced; The coplanarity of components cannot be ignored, and devices with poor coplanarity should not be used in production. Five. After welding, there will be light green bubbles around the individual solder joints, and in serious cases, there will be a bubble the size of a nail, which not only affects the appearance quality, but also affects the performance in serious cases, which is one of the problems that often occur in the welding process. The root cause of the welding resistance film foaming is the presence of gas/water vapor between the welding resistance film and the positive substrate. Trace amounts of gas/water vapor are carried to different processes, and when high temperatures are encountered, gas expansion leads to the delamination of the solder resistance film and the positive substrate. During welding, the temperature of the pad is relatively high, so the bubbles first appear around the pad. Now the processing process often needs to be cleaned, dry and then do the next process, such as after etching, should be dried and then stick the solder resistance film, at this time if the drying temperature is not enough will carry water vapor into the next process. The PCB storage environment is not good before processing, the humidity is too high, and the welding is not dried in time; In the wave soldering process, often use a water-containing flux resistance, if the PCB preheating temperature is not enough, the water vapor in the flux will enter the inside of the PCB substrate along the hole wall of the through hole, and the water vapor around the pad will first enter, and these situations will produce bubbles after encountering high welding temperature. The solution is: (1) all aspects should be strictly controlled, the purchased PCB should be inspected after storage, usually under standard circumstances, there should be no bubble phenomenon. (2) PCB should be stored in a ventilated and dry environment, the storage period is not more than 6 months; (3) PCB should be pre-baked in the oven before welding 105℃/4H ~ 6H;

The lack of solder in the crest solder joint means that the solder joint is shriveled, the solder joint is incomplete with holes (blow holes, pinholes), the solder is not full in the cartridge holes and through holes, or the solder does not climb to the plate of the component surface.Wave solder shortage phenomenonWave solder shortage phenomenon 1, PCB preheating and welding temperature is too high, so that the viscosity of the molten solder is too low. Preventive measures: the preheating temperature is 90-130 ℃, and the upper limit of preheating temperature is taken when there are more mounted components; Solder wave temperature is 250±5℃, welding time is 3~5s; 2, the aperture of the insertion hole is too large, and the solder flows out of the hole. Preventive measures: The aperture of the insertion hole is 0.15~0.4mm straight than the pin (the lower limit is taken for the thin lead, the upper limit is taken for the thick lead); 3, insert the component fine lead large pad, the solder is pulled to the pad, so that the solder joint is shriveled. Preventive measures: the size of the pad and the diameter of the pin should match, which should be conducive to the formation of the meniscus solder joint. 4. Poor quality of metallized holes or flux resistance flowing into holes. Preventive measures: reflect to the printed board processing plant, improve the processing quality; 5, the crest height is not enough. Cannot make the printed board produce pressure on the solder wave, which is not conducive to tinning. Preventive measures: the peak height is generally controlled at 2/3 of the thickness of the printed board; 6, the printed board climbing Angle is small, is not conducive to flux exhaust. The climbing Angle of the printed board is 3-7°.

The tip of the wave crest solder joint is that the solder on the wave crest solder joint is in the shape of milky stone or water column when the circuit board is welded by the wave crest, and this form is said to be the tip. Its essence is that the solder is generated by gravity greater than the internal stress of the solder, and the reasons for this are analyzed as follows:(1) Poor flux or too little: this reason will cause the soldering solder to be wet on the surface of the solder spot, and the solder on the surface of the copper foil is very poor, at this time, it will produce a large area of the PCB board.(2) The transmission Angle is too low: the PCB transmission Angle is too low, the soldering solder is easy to accumulate on the surface of the solder joint in the case of relatively poor fluidity, and the condensation process of the solder is eventually due to the gravity is greater than the internal stress of the solder, forming a pull tip.(3) Solder crest velocity: the scouring force of the solder crest on the solder joint is too low, and the fluidity of the solder is in a poor state, especially lead-free tin, the solder joint will adsorb a large number of solder joints, which is easy to cause too much solder and produce a pull tip.(4) PCB transmission speed is not suitable: the setting of wave soldering transmission speed must meet the requirements of the welding process, if the speed is suitable for the welding process, the formation of the tip can be unrelated to this.(5) Too deep tin immersion: too deep tin immersion will cause the soldering solder joint to be completely coked before leaving, because the surface temperature of the PCB board is too high, the PCB solder will accumulate a large amount of solder on the solder joint due to the diffusability change, forming a pull tip. The solder depth should be appropriately reduced or the welding Angle increased.(6) Wave welding preheating temperature or tin temperature deviation is too large: too low temperature will make the PCB into the solder, the solder surface temperature drops too much, resulting in poor fluidity, a large number of solder will accumulate on the solder surface to produce a pull tip, and too high temperature will make the flux coking, so that the wettability and diffusion of the solder become worse, may form a pull tip.

Alarm item software processing method Alarm cause alarm exclusionSystem power failure The system automatically enters the cooling state and automatically sends the PCB in the furnace to the external power failureInternal circuit fault Repair external circuitOverhaul internal circuitryIf the hot air motor does not rotate, the system automatically enters the cooling stateThe hot air motor is damaged or stuck. Check the inverterReplace or repair the motorIf the transmission motor does not rotate, the system automatically enters the cooling stateMotor is not stuck or damaged check frequency conversionReplace or repair the motorThe board drop system automatically enters the cooling state. The PCB falls or gets stuckElectrical eye damage at transport inlet and outletThe external object mistakenly senses the entrance electric eye and sends the board out to replace the electric eyeIf the lid is not closed, the system automatically enters the cooling state The lifting screw travel switch is shifted to close the upper furnace and restartReadjust the position of the travel switchWhen the temperature exceeds the upper limit, the system automatically enters the cooling stateSolid state relay output short circuitThe computer and PLC cable are unpluggedCheck whether the temperature control template works properly. Replace the hot spot coupleReplace solid state relayPlug in the stripCheck the temperature control templateIf the temperature is lower than the minimum temperature, the system automatically enters the cooling state. The output end of the solid-state relay is disconnectedGround the thermocoupleThe leakage switch of the generator tube is switched off to replace the solid state relayAdjust the thermocouple positionRepair or replace the heating pipeWhen the temperature exceeds the alarm value, the system automatically enters the cooling stateThe output end of the solid state relay is normally closedThe computer and PLC cable are unpluggedCheck whether the temperature control template works properly. Replace the thermocoupleReplace solid state relayPlug in the stripCheck the temperature control templateThe system automatically enters the cooling state when the temperature is lower than the alarm value. The output end of the solid-state relay is disconnectedGround the thermocoupleThe leakage switch of the generator tube is switched off to replace the solid state relayCheck the temperature control templateThe system automatically enters the cooling state when the temperature is lower than the alarm value. The output end of the solid-state relay is disconnectedGround the thermocoupleThe leakage switch of the generator tube is switched off to replace the solid state relayAdjust the thermocouple positionRepair or replace the heating pipeThe transport motor speed deviation is large. The system automatically enters the cooling state. The transport motor is faultyEncoder faultInverter failure Replace the motorFix and replace encoderChange frequency converterThe start button is not reset The system is in the waiting state. The emergency switch is not resetThe start button is not pressedStart button damagedLine damage reset emergency switch and press start buttonReplacement buttonFix the circuitPress the emergency switch The system is in the waiting state. Press the emergency switchReset the emergency switch and press the start button to check the external circuitHigh temperature1. The hot air motor is faulty2. The wind turbine is faulty3. Solid state relay output short circuit4. Check the wind wheel5. Replace the solid state relay working processThe machine cannot start. 1. The upper furnace body is not closed 2. The emergency switch is not reset3. The start button is not pressed4. Check the emergency switch5. Press the Start button to start the processThe temperature in the heating zone does not rise to the set temperature 1. The heater is damaged2. The power-on couple is faulty3. The output end of the solid state relay is disconnected4. The exhaust is too large or the left and right exhaust is unbalanced5. The photoelectric isolation device on the control board is damaged The transport motor is abnormal. The transport thermal relay detects that the motor is overloaded or stuck1. Restart the transport thermal relay2. Check or replace the thermal relay3. Reset the thermal relay current measurement valueInaccurate count1. The sensing distance of the counting sensor is changed2. The counting sensor is damaged3. Adjust the sensing distance of the technical sensor4. Replace the counting sensorThe error of the speed value on the computer screen is large1. The speed feedback sensor senses the wrong distance 2. Check whether the encoder is faulty 3. Check the encoder circuit

In the process of welding in an aerobic environment, secondary oxidation will occur, resulting in poor wetting, especially in the miniaturization and close spacing process, which will lead to more deadly hazards: voids, which easily lead to a decrease in the strength of the solder joints of micro-components; Tin ball, easy to lead to short circuit between closely spaced components; Virtual welding affects the electrical performance and service life of the product. HB reflow low oxygen concentration control technology is specifically designed for expensive components, double-sided assembly, micro-spaced components, small volume components, high temperature solders, and production processes that require high reliability for welding. The results show that in nitrogen environment, the surface tension of liquid solder decreases and the wetting Angle increases by 40%. Increase wetting capacity by 3-5%; Wetting time can be reduced by 15%; Effectively reduce peak temperature and shorten reflux time. In the SELEIT reflow nitrogen system, the oxygen concentration can be independently controlled throughout the whole process, which effectively solves the above problems.

In the reflow welding process, welding large heat-absorbing PCB products (especially with metal fixtures), the cooling process has a great impact on the welding quality, but also a process that requires very high temperature control ability, if the cooling speed is too slow during the cooling process, it will lead to low solder joint strength, high outlet temperature, and even in a semi-molten state. Affect the next process of online equipment, such as the use of online AOI. Haobao Reflow adopts unique structural design and cooling technology to achieve fast cooling process, ensuring high cooling slope and low exit temperature of PCB products

Reflow daily maintenance content: (1) Check whether there is grease in the transmission chain, and add grease in time if necessary. (2) Check that there is no running edge in the transport network, and notify HB in time if there is running edge. (3) Check the reflow furnace inlet mesh belt drive wheel is not shifted, if there is a shift can be adjusted by loosening the screw - adjusting - locking the screw step. (4) Check whether the net belt drive roller at the outlet of reflow furnace is loose, if it is loose, it can be adjusted according to the steps of loosening the screws - adjusting - locking screws. (5) Check whether the high temperature oil in the oil cup is appropriate, the oil surface should be 5mm from the mouth of the cup, if necessary, add high temperature oil in time. Reflow maintenance content: (1) Check the surface of the transport network belt for dirt adhesion, if there is loot adhesion in time with alcohol scrub. (2) Check the guide rail chain groove for foreign bodies, if there are foreign bodies in time to remove the chain with alcohol scrub. (3) Check whether the bearings of the driven gear of the transport chain are flexible, and add lubricating oil in time when necessary. (5) Check whether there is grease on the surface of the lead rod of the head component and no foreign matter, wipe it clean in time when necessary, and add grease. (6) Check whether there is FLUX and dust on the rectifier plate in each area of the furnace, and clean it with alcohol in time if there is dust. (7) Check whether the lifting motor of the furnace lifting system is running without vibration and noise, if there is vibration or noise, it should be replaced in time (8) Check whether the filter of the exhaust device is blocked, if there is blockage, alcohol should be used to clean. (9) Check whether there is FLUX adsorption on the rectifier plate in the cooling area of the cooling system. If there is FLUX, it should be cleaned with alcohol in time. (10) Check that the surface of the photoelectric switch at the transport entrance has dust-free accumulation. If there is dust accumulation, it should be wiped clean with a soft dry rag in time. (11) Check whether the surface of the PC and UPS is clean. If there is dust accumulation, it should be wiped with a soft dry cloth in time. Monthly maintenance contents of reflow welding: (1) Check whether there is vibration and noise in the transportation process, and notify HB in time if necessary. (2) Check whether the transport motor fixing screw is loose, if it is loose, lock the screw. (3) Check whether the tension of the transmission chain is appropriate, and adjust the motor positioning screw in time if necessary. (4) Check whether there is coke and black powder on the transport chain, if there is, it should be removed in time and cleaned with diesel oil. (5) Check the positioning of the synchronous shaft of the width adjustment in the track of the active end, and whether the fixed block is loose. If it is loose, it should be locked in time. (6) Check whether the hot air motor positioning screw is loose, if loose, it should be locked in time. (7) Check whether there is dust and foreign matter in the control box of the electrical system. If there is foreign matter, blow out dust and foreign matter with the same pressure air after power off.

YINCAE has launched the UF 120LA, a high-purity liquid epoxy filling material designed for advanced electronic packaging. The UF 120LA has excellent fluidity and can fill narrow gaps up to 20 μs, avoiding cleaning processes and thus reducing costs and environmental impact while ensuring superior performance in applications such as BGA, flip chips, WLCSP and multi-chip modules. The UF 120LA can withstand five 260°C reflux cycles without distortion of the solder joint, surpassing competitors that require cleaning. Its ability to cure at lower temperatures increases production efficiency and makes it ideal for use in memory cards, chip carriers and hybrid integrated circuits. The superior thermal performance and mechanical durability of the UF 120LA enable manufacturers to develop more compact, reliable, and high-performance devices, driving the trend toward miniaturization, edge computing, and Internet of Things (IoT) connectivity. This technological advancement will enhance the production of critical applications such as 5G and 6G infrastructure, autonomous vehicles, aerospace systems and wearable technology, where reliability and durability are critical. In addition, by streamlining the manufacturing process, the UF 120LA accelerates the speed to market of consumer electronics, potentially reshaping supply chain efficiency and creating new opportunities for economies of scale. In the long term, widespread adoption of this technology could revolutionize the field of semiconductor packaging, laying the foundation for increasingly complex electronic devices that will be lighter, more efficient, and more resilient in extreme environments. Key Benefits: • No cleaning compatibility - Compatible with all non-cleaning solder paste residues. Cost savings - eliminate cleaning processes and pollution control. • High thermal reliability - can withstand multiple reflux cycles without deformation. • Excellent fluidity - narrow gaps up to 20 μs can be filled. • Low warpage - low CTE and high thermal stability. "The UF 120LA represents a significant advance in electronic packaging technology," said YINCAE Chief Technical Officer. "The UF 120LA enables manufacturers to push the boundaries of advanced packaging applications, from BGA to wafer-scale chip-scale packaging. We believe this product will set new industry standards for performance and efficiency.

In recent years, Longqi Technology takes the smartphone ODM business as the core, and actively expands the diversified business of tablet computer, smart wear, XR, AI PC, automotive electronics, etc., and has achieved remarkable results in these new business areas, thus driving its business performance to maintain rapid growth. In the first three quarters of 2024, the business of various sectors of Longqi Technology continued to grow, achieving operating income of 34.9 billion yuan, an increase of 101%. Among them, the company's smartphone business achieved revenue of 27.9 billion yuan, an increase of 98% year-on-year, continuing to lead the global smartphone ODM market, and its market share increased steadily. This growth trend is expected to be maintained throughout the year, demonstrating Longqi's strong strength and solid market share gains in the smartphone ODM segment. From the perspective of smartphone ODM/IDH shipments, in the first half of 2024, Longqi Technology ranked first with a 35% market share. Ivan Lam, senior Research Analyst at Counterpoint Research, said: "Longqi maintained its strong momentum, with shipments growing 50% year-on-year in the first half. This high growth was mainly driven by strong shipments from Chinese brands, especially Xiaomi, Huawei and MOTOROLA, as well as Samsung. Xiaomi's performance improved in several key regions including China, India, the Caribbean and Latin America, as well as Central and East Africa." In accepting institutional research, Longqi Technology said that in the third quarter, the company continued to lead the global smartphone ODM market, the company's market share increased steadily, and the business scale continued to maintain rapid growth. There are mainly three reasons: First, the company adopted a more active market strategy, obtained more customers' main projects, the company's market share has been further increased, and the customer structure has been more optimized. Second, some of the company's customers have their own business growth. In addition, the company's cooperation business with individual customers in India is growing faster, and the business model in which the amount of Buy&Sell is large has brought about revenue growth. In addition to the smartphone business, Longqi Technology's tablet computer and AIoT product business also performed well. In the first three quarters of 2024, the company's tablet computer business achieved revenue of 2.6 billion yuan, an increase of 78% over the same period last year. While continuously expanding the high-end and productive product portfolio, the company also actively expanded the customer base of the tablet computer business and continued to optimize the customer structure. AIoT product business achieved revenue of 3.8 billion yuan, an increase of 135%. The company's AIoT business mainly includes smart watches, smart bracelets, TWS headphones, XR products, etc., and the main projects continue to increase. It is worth mentioning that with the vigorous development of AI technology, Longqi Technology is accelerating its entry into the new track of AI intelligent hardware, and showing significant development potential and strong market competitiveness. In 2024, Longqi Technology completed the research and development, manufacturing and shipment of a number of products in the field of AI intelligent hardware, of which the shipment performance of the second-generation AI smart glasses products cooperated with global Internet head customers was particularly excellent. At the same time, the company's first Qualcomm Snapdragon platform laptop project successfully produced goods, which have been sold in the domestic and European markets. The company also landed the Qualcomm Snapdragon platform AI Mini PC project for the world's leading customers of laptops, injecting strong impetus into the expansion of AI applications in commercial and consumer fields. In addition, the company actively negotiates cooperation with major internationally renowned laptop customers on X86 architecture projects, and strives to land more new AI PC projects one after another. As the AI side application is accelerating the update, in addition to AI PC, Longqi Technology's smart hardware products such as mobile phones, tablets, XR, wristbands, TWS headphones also ushered in innovation opportunities, the company also conforms to the global AI technology development trend, actively follow up and layout of wireless communication, optics, display, audio, simulation and other underlying core technologies. To provide customers with full scene AI intelligent terminal product solutions. In the future, with the continuous evolution of AI technology and the growing market demand, Longqi Technology is expected to achieve more brilliant achievements in the field of AI intelligent hardware.

According to the latest forecast data released by market research firm Gartner, the total global semiconductor revenue in 2024 will be $626 billion, an increase of 18.1%. Among the top 10 semiconductor manufacturers in the world in 2024, Samsung, Intel and Nvidia rank the top three. At the same time, Gartner expects that, driven by the demand for AI, total global semiconductor revenue will increase by 12.6% year-on-year to reach $705 billion in 2025. While this forecast is lower than Future Horizons' 15 percent forecast, it is higher than the World Semiconductor Trade Organization's 11.2 percent estimate and Semiconductor Intelligence's 6 percent estimate. "Graphics processing units (Gpus) and AI processors used in data center applications (servers and accelerator cards) are key drivers for the chip industry in 2024," said George Brocklehurst, vice president analyst at Gartner. "The growing demand for artificial intelligence and Generative Artificial Intelligence (GenAI) workloads has led to data centers becoming the second largest semiconductor market after smartphones in 2024. Data center semiconductor revenue totaled $112 billion in 2024, up from $64.8 billion in 2023." Looking at specific vendor performance, only eight of the top 25 semiconductor suppliers by revenue in 2024 experienced a decline in semiconductor revenue, while 11 suppliers achieved double-digit percentage growth. Among the top 10 manufacturers, only Infineon's semiconductor revenue declined year-on-year, and the rest achieved year-on-year growth. ● Samsung Electronics' semiconductor revenue in 2024 is expected to be $66.5 billion, up 62.5% year on year, mainly due to the growth in demand for memory chips and a strong rebound in prices, successfully helping Samsung Electronics regain the top position from Intel and extend its lead over the company. Samsung Electronics' financial report also shows that in 2024, Samsung Electronics' DS division, which is mainly engaged in semiconductor business including memory and wafer foundry, generated annual revenue of 111.1 trillion won, an increase of 67%. Samsung also attributed the increase to higher average selling prices of DRAM and increased sales of HBM and high-density DDR5. Its HBM3E products have already been mass-produced and sold in the third quarter of 2024, and in the fourth quarter of 2024, HBM3E has been supplied to several GPU vendors and data center vendors, and sales have exceeded HBM3. HBM sales for the full fourth quarter were up 190% sequentially, but this was still lower than previously expected. "The 16-layer HBM3E is in the phase of customer sample delivery, and the sixth generation HBM4 is expected to be mass-produced in the second half of 2025," a Samsung official said. Intel's 2024 semiconductor revenue is expected to be $49.189 billion, up only 0.1% year over year, ranking second in the world. While the AI PC market and its Core Ultra chipset appear to be seeing decent growth, its AI accelerator products and overall x86 business are doing so-so. Intel's latest earnings report shows that its overall revenue in the 2024 fiscal year was $53.1 billion, down 2% from the same period last year. After the outbreak of Intel's financial crisis in September 2024, Intel announced that it would reduce its global workforce by 15%, cut capital expenditures (by $10 billion in capital expenditures by 2025), and suspend the construction of factories in Germany and Poland. Although Intel's performance has improved in the next two quarters, it is still not optimistic. Looking at full-year 2024 performance by segment, its customer computing group revenue increased only 3.5% year-over-year to $30.29 billion, and data center and Artificial intelligence (AI) group revenue increased only 1.4% year-over-year to $12.817 billion. In contrast, Nvidia, AMD and other chip manufacturers have benefited from the growth of AI demand, and their AI business revenue has a high double-digit percentage increase. Nvidia's 2024 semiconductor revenue jumped 84% year over year to $46 billion. Due to the strong demand for its AI chips, it moved up two places in the ranking, ranking third globally. According to Nvidia's previously announced financial results for the third quarter of fiscal year 2025 ending on October 27, 2024, revenue for the quarter reached $35.1 billion, up 94% year-on-year and up 17% sequentially. For the fourth quarter, Nvidia expects revenue of $37.5 billion, plus or minus 2 percent, up 70 percent sequentially from the third quarter. SK Hynix semiconductor revenue in 2024 is expected to reach $42.824 billion, up 86% year-on-year, and its ranking has also risen two places to fourth in the world. SK Hynix's growth was mainly due to strong growth in its High bandwidth (HBM) business. SK Hynix's latest financial report shows that its revenue in 2024 was 66.1930 trillion won, up 102% year-on-year, a new high in revenue over the past year, and its operating profit exceeded the performance of the ultra-prosperous memory chip market in 2018. SK Hynix also announced that it achieved its highest annual performance thanks to industry-leading HBM technology strength and profitable business activities amid strong demand for semiconductor memory for AI. Among them, HBM, which showed a high growth trend in the fourth quarter of 2024, accounted for more than 40% of the entire DRAM sales (30% in the third quarter), and enterprise solid state drive (eSSD) sales continued to increase. The company has established a stable financial position based on profitable operations based on the competitiveness of differentiated products, thus continuing to maintain the trend of performance improvement. Qualcomm's 2024 semiconductor revenue was $32.358 billion, up 10.7% year-over-year and dropping two places to fifth. Although Qualcomm's revenue growth is much lower than Samsung, Nvidia, SK Hynix and other leading manufacturers, but thanks to the help of its Snapdragon 8 extreme mobile platform, its revenue growth is still better than the growth of the smartphone market (market research agency Canalys data show that the global smartphone market in 2024 strong rebound shipments reached 1.22 billion units, Year-on-year growth of 7%). However, Qualcomm's energy-consuming Snapdragon X series platform for the PC market is not successful, data show that Qualcomm Snapdragon X series PC only shipped 720,000 units in the third quarter, with a market share of only 0.8%. According to Qualcomm's financial report for the fiscal year 2024, which ended on September 29, 2024, Qualcomm's revenue for the fiscal year was $38.962 billion, an increase of 9% compared to $35.82 billion in the previous fiscal year. In terms of revenue sources, 46% came from customers based in China. Driven by the Snapdragon 8 Extreme mobile platform, Qualcomm expects revenue for the first quarter of fiscal 2025 (equivalent to the fourth quarter of Natural year 2024) to be between $10.5 billion and $11.3 billion, with a median of $10.9 billion, higher than the average market analyst estimate of $10.54 billion. Micron's semiconductor revenue in 2024 is expected to be $27.843 billion, up 72.7% year on year, and moving up six places to sixth. The growth of Micron's revenue and ranking is also mainly due to the strong demand for HBM in the AI market. According to Micron's financial report for the fiscal year 2024, which ended on August 29, 2024, its revenue for the fiscal year 2024 reached $25.111 billion, a year-on-year increase of 61.59%. Micron pointed out that as one of Micron's highest margin products, its HBM revenue for AI data processing has maintained strong growth. Its data center business, where HBM is located, achieved record annual revenue in fiscal year 2024 and will grow significantly in fiscal year 2025. This year and next year, Micron's HBM production capacity has been sold out, and during this period, Micron has also finalized HBM order prices for this year and next year with customers. The subsequent Micron 2025 fiscal year first quarter (as of November 28, 2024) earnings report showed that the fiscal quarter revenue was $8.709 billion, close to the average analyst expectation of $8.71 billion, an increase of 84.1% year on year, an increase of 12.4% quarter on quarter, a record high. While first-quarter results were indeed weighed down by DRAM inventory overhang in end-markets such as smartphones and PCS, they were offset by a 400% explosion in the data center business, driven by cloud server DRAM demand and HBM revenue growth. Although the HBM market is currently dominated by SK Hynix, this year, Micron's HBM3E entered Nvidia's H200 artificial intelligence chip and the newly developed strongest Blackwell system, which will greatly stimulate Micron's HBM revenue growth. Micron CEO has previously predicted that the global market size of HBM chips will increase to about $25 billion in 2025, significantly higher than the $4 billion in 2023, which will also boost the memory chip market size to jump to $204 billion in 2025. In the first quarter earnings call, Micron's CEO has increased the HBM market size to $30 billion in 2025. Broadcom's 2024 semiconductor revenue is expected to be $27.841 billion, up 7.9% year over year, but it will slip three places to seventh. Broadcom's revenue for fiscal year 2024, which ended November 3, 2024, was approximately $51.6 billion, an increase of 44% year-over-year and a record high. But that revenue growth was largely due to the acquisition of VMware, which combined the two companies' revenues. Hock Tan, President and CEO of Broadcom, also explained, "Broadcom's revenue for fiscal year 2024 increased 44% year-over-year to a record $51.6 billion, as infrastructure software revenue grew to $21.5 billion." "However, driven by AI's demand for custom chips, Broadcom's semiconductor revenue also reached a record $30.1 billion in fiscal year 2024, including $12.2 billion in AI revenue, up 220% year-over-year, driven by our leading AI XPU and Ethernet networking portfolio." AMD's 2024 semiconductor revenue is expected to be $23.948 billion, up 7.4% year-over-year and slipping one place to eighth. According to AMD's fiscal year 2024 financial report released on February 4, 2025 local time, the fiscal year revenue reached a record $25.8 billion, an increase of 14%. Benefiting from the strong demand in the AI market, AMD's data center division's revenue reached a new high of $12.6 billion in 2024, up 94% from the same period last year. In addition, its PC chip client segment revenue in 2024 also reached a new high of $2.3 billion, up 58% year on year. But the games division saw revenue plunge 58% to $2.6 billion due to a decline in semi-custom revenue. Embedded segment revenue in 2024 also plunged 33% year-over-year to $3.6 billion, primarily due to normalization of inventory levels as customers clear inventory. Apple's 2024 semiconductor revenue is expected to be $18.88 billion, up 4.6% year over year and up 1 place to ninth. Apple's financial results for the fiscal year 2024, which ended on September 28, showed that its revenue for the fiscal year increased only 2% to $391 billion due to slowing demand in the smartphone and PC markets. The latest financial report for the first quarter of the fiscal year 2025 (the fourth quarter of 2024) shows that Apple's revenue for the quarter increased 4% year-on-year to $124.3 billion, a record high, and better than analysts' expectations of $124.1 billion. Revenue from its core iPhone business edged down 0.9% year-over-year, but it still generated $69.138 billion. Mac revenue increased 15.5 percent to $8.987 billion. iPad revenue also increased 15.2% year-over-year to $8.088 billion. At present, Apple's iPhone/Mac/iPad product line is basically using its own processors. ● Infineon's 2024 semiconductor revenue is expected to be $16.01 billion, down 6% year on year and down one place to 10th. According to Infineon's financial results for the fiscal year 2024 to the end of September 2024, Infineon's revenue for the fiscal year decreased by 8% to 14.955 billion euros, a year-on-year decrease of 8%. Infineon CEO Jochen Hanebeck also said in a statement at the time: "Currently, with the exception of artificial intelligence, our end markets have virtually no growth drivers and cyclical recovery is being delayed." As a result, we are preparing for a lower business trajectory in 2025." However, Infineon's financial report for the first quarter of the fiscal year 2025 ending December 31, 2024, announced on February 4, 2025 local time, showed that the revenue of the fiscal quarter was 3.424 billion euros, down 13% year-on-year. This was mainly due to weaker demand in four segments: Automotive (ATV), Green Industrial Power (GIP), Power and Sensor Systems (PSS), and Connected Security Systems (CSS). However, the overall results were still better than market expectations, and as a result, Infineon revised its revenue for fiscal year 2025 from "slightly down" to "flat or slightly up" for now. HBM has become the growth engine of the head memory manufacturers, and will account for 19.2% of the overall DRAM revenue in 2025, Gartner data also shows that in 2024, global memory chip revenue soared 71.8% year-on-year, making the share of memory chips in total semiconductor sales increased to 25.2%. In contrast, in 2024, semiconductor revenue outside of storage only grew by 6.9% year-over-year, of which DRAM revenue grew by 75.4% in 2024 and NAND revenue grew by 75.7% year-over-year. HBM's revenue growth contributed significantly to the DRAM vendor's revenue. In 2024, HBM's revenue will account for 13.6% of total DRAM revenue. It is expected to further increase to 19.2% by 2025. According to Brocklehurst, "Memory and AI semiconductors will drive near-term growth, with HBM's share of DRAM revenues expected to increase, reaching 19.2% by 2025." HBM's revenue is expected to grow 66.3 percent to $19.8 billion by 2025.

What is SMT?A SMT is Surface assembly Technology (short for Surface Mounted Technology), is the most popular technology and process in the electronic assembly industry. It compresses traditional electronic components into only a few tens of the volume of the device, thus realizing the assembly of electronic products of high density, high reliability, miniaturization, low cost, and production automation. This miniaturized component is called: SMY device (or SMC, chip device). The process of assembling components onto a print (or other substrate) is called the SMT process. The associated assembly equipment is called SMT equipment. At present, advanced electronic products, especially in computers and communication electronic products, have widely adopted SMT technology. The international output of SMD devices has increased year by year, while the output of traditional devices has decreased year by year, so with the passage of SMT technology will become more and more popular. SMT features: 1, high assembly density, small size of electronic products, light weight, the size and weight of the patch components is only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products reduced by 40% to 60%, the weight reduced by 60% to 80%. 2, high reliability, strong vibration resistance. Low defect rate of solder joint. 3, good high-frequency characteristics. Reduced electromagnetic and radio frequency interference. 4, easy to achieve automation, improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Why use Surface Mount Technology (SMT)? 1, the pursuit of miniaturization of electronic products, previously used perforated plug-in components have been unable to shrink 2, electronic products function more complete, the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, have to use surface patch components. 3, product mass, production automation, the factory to low cost and high output, produce quality products to meet customer needs and strengthen market competitiveness 4, the development of electronic components, integrated circuit (IC) development, semiconductor materials of multiple applications 5, electronic technology revolution is imperative, chasing the international trend. What are the features of QSMT?AHigh assembly density, small size and light weight of electronic products, the volume and weight of the patch components are only about 1/10 of the traditional plug-in components, generally after the use of SMT, the volume of electronic products is reduced by 40% to 60%, and the weight is reduced by 60% to 80%.High reliability and strong vibration resistance. Low defect rate of solder joint.Good high frequency characteristics. Reduced electromagnetic and radio frequency interference.Easy to automate and improve production efficiency. Reduce the cost by 30%~50%. Save materials, energy, equipment, manpower, time, etc. Q Why use SMTAElectronic products pursue miniaturization, and previously used perforated plug-in components can no longer be reducedThe function of electronic products is more complete, and the integrated circuit (IC) used has no perforated components, especially large-scale, highly integrated ics, and surface patch components have to be usedProduct mass, production automation, manufacturers to low cost and high output, produce high-quality products to meet customer needs and strengthen market competitivenessDevelopment of electronic components, development of integrated circuits (ics), multiple applications of semiconductor materialsThe revolution of electronic science and technology is imperative, and the pursuit of international trendsQ Why use lead-free processALead is a toxic heavy metal, excessive absorption of lead by the human body will cause poisoning, intake of low amounts of lead may have an impact on human intelligence, nervous system and reproductive system, the global electronic assembly industry consumes about 60,000 tons of solder every year, and is increasing year by year, the resulting lead-salt industrial slag seriously polluted the environment. Therefore, reducing the use of lead has become the focus of worldwide attention, many large companies in Europe and Japan are vigorously accelerating the development of lead-free alternative alloys, and have planned to gradually reduce the use of lead in the assembly of electronic products in 2002. It will be completely eliminated by 2004. (The traditional solder composition of 63Sn/37Pb, in the current electronic assembly industry, lead is widely used).Q What are the requirements for lead-free alternativesA1, price: Many manufacturers require that the price cannot be higher than 63Sn/37Pn, but at present, the finished products of lead-free alternatives are 35% higher than 63Sn/37Pb.2, the melting point: most manufacturers require a minimum solid phase temperature of 150 ° C to meet the working requirements of electronic equipment. The liquid phase temperature depends on the application.Electrode for wave soldering: For successful wave soldering, the liquid phase temperature should be below 265 ° C.Solder wire for manual welding: liquid phase temperature should be lower than the working temperature of the soldering iron 345℃.Solder paste: liquid phase temperature should be lower than 250℃.3. Electrical conductivity.4, good thermal conductivity.5, small solid-liquid coexistence range: most experts recommend that this temperature range be controlled within 10 ° C, in order to form a good solder joint, if the alloy solidification range is too wide, it is possible to crack the solder joint, so that electronic products premature damage.6, low toxicity: the alloy composition must be non-toxic.7, with good wettability.8, good physical properties (strength, tensile, fatigue) : the alloy must be able to provide the strength and reliability that Sn63/Pb37 can achieve, and there will be no protruding fillet welds on the passing device.9, the production of repeatability, solder joint consistency: because the electronic assembly process is a mass manufacturing process, requires its repeatability and consistency to maintain a high level, if some alloy components can not be repeated in mass conditions, or its melting point in mass production due to changes in the composition of the larger changes, it can not be considered.10, solder joint appearance: solder joint appearance should be close to the appearance of tin/lead solder.11. Supply ability.12, compatibility with lead: due to the short term will not immediately be fully transformed into a lead-free system, so lead may still be used on the PCB pad and component terminals, such as mixing such as drilling in the solder, may make the melting point of the solder alloy drop very low, the strength is greatly reduced.

Many people are not familiar with reflow welding, because they have not operated or seen it, the concept of reflow welding is very vague, then what is reflow welding? Reflow is the soldering of mechanical and electrical connections between the solder ends or pins of surface-assembled components and the printed board solder pad by remelting the paste solder preallocated to the printed board pad. Reflow welding is to weld the components to the PCB board, and reflow welding is to mount the devices on the surface. Reflow welding is based on the action of hot gas flow on the solder joint. The gel flux reacts physically under certain high temperature air flow to achieve SMD welding. The reason why it is called "reflow welding" is because the gas circulates in the welding machine to produce high temperature to achieve the purpose of welding. Reflow technology is not new in the field of electronics manufacturing. The components on the various boards used in our computers are welded to the circuit board through this process. This device has a heating circuit inside the device, and the air or nitrogen is heated to a high enough temperature to blow to the board that has been attached to the components, so that the solder on both sides of the components is melted and bonded to the motherboard. The advantages of this process are that the temperature is easy to control, oxidation can be avoided during welding, and manufacturing costs are easier to control. There are several categories of reflow welding: hot plate conduction reflow, infrared reflow, gas phase reflow, hot air reflow, infrared + hot air reflow, hot wire reflow, hot gas reflow, laser reflow, beam reflow, induction reflow, polyinfrared reflow, table reflow, vertical reflow, nitrogen reflow.

Wave soldering refers to the melting of soft brazing material (lead-tin alloy), through the electric pump or electromagnetic pump jet into the design requirements of the solder crest, can also be formed by injecting nitrogen into the solder pool, so that the printed board pre-equipped with components through the solder crest, to achieve the mechanical and electrical connection between the component welding end or pin and the printed board welding pad. Wave soldering process: Insert the component into the corresponding component hole → pre-apply flux → preheat (temperature 90-100℃, length 1-1.2m) → Wave soldering (220-240℃) cooling → remove excess pin → Check. Wave soldering with the enhancement of people's awareness of environmental protection has a new welding process. In the past, tin-lead alloy was used, but lead is a heavy metal that has great harm to the human body. Therefore, the lead-free process is promoted, the use of * tin silver copper alloy * and special flux, and the welding temperature requires higher preheating temperature. In most of the products that do not require miniaturization and high power are still using perforated (TH) or mixed technology circuit boards, such as televisions, home audio and video equipment and digital set-top boxes, are still using perforated components, so the need for wave soldering. From a process point of view, wave soldering machines can only provide a few of the most basic equipment operating parameters adjustment.

1. Wave soldering is to dissolve the tin strip into a liquid state through the tin tank, and use the motor to stir to form a wave peak, so that the PCB and the parts are welded together, which is generally used for the welding of the hand plug-in and the SMT glue board. Reflow welding is mainly used in the SMT industry, which melts and welds the solder paste printed on the PCB through hot air or other thermal radiation conduction. 2. Different processes: wave soldering should first spray flux, and then go through preheating, welding, and cooling zone. Reflow welding through preheating zone, reflow zone, cooling zone. In addition, wave soldering is suitable for hand insert board and dispensing board, and all components are required to be heat-resistant, over the crest surface can not have the SMT solder paste components, SMT solder paste board can only be reflow soldering, can not use wave soldering. Let's explain it in the simplest way possible Reflow soldering: Mechanical and electrical connections between surface-attached component terminals or pins and printed circuit board pads are achieved by remelting paste paste pre-allocated to the printed circuit board pads. It is a step in SMT (Surface Mount Technology). Wave soldering: wave soldering is a kind of automatic soldering equipment through high temperature heating to weld plug-in components, from the function, wave welding is divided into lead wave welding, lead-free wave welding and nitrogen wave welding, from the structure, a wave welding is divided into spray, preheating, tin furnace, cooling four parts.

SMT basic process components include: screen printing (or dispensing), mounting (curing), reflow welding, cleaning, testing, repair.1. Screen printing: Its role is to leak the solder paste or patch glue onto the solder pad of the PCB to prepare for the welding of components. The equipment used is a screen printing machine (screen printing machine), located at the forefront of the SMT production line.2, dispensing: it is the glue drops to the fixed position of the PCB, its main role is to fix the components to the PCB board. The equipment used is the dispensing machine, which is located at the front end of the SMT production line or behind the testing equipment.3, mounting: Its role is to accurately install the surface assembly components to the fixed position of the PCB. The equipment used is the SMT machine, which is located behind the screen printing machine in the SMT production line.4, curing: its role is to melt the patch glue, so that the surface assembly components and PCB board firmly bonded together. The equipment used is the curing furnace, which is located behind the SMT machine in the SMT production line.5, reflow welding: its role is to melt the solder paste, so that the surface assembly components and PCB board firmly bonded together. The equipment used is a reflow furnace, which is located behind the SMT machine in the SMT line.6. Cleaning: Its role is to remove welding residues such as flux that are harmful to the human body on the assembled PCB. The equipment used is a cleaning machine, the position can not be fixed, can be online, or not online.7, detection: its role is to assemble the PCB board welding quality and assembly quality detection. The equipment used includes magnifying glass, microscope, on-line tester (ICT), flying needle tester, automatic Optical inspection (AOI), X-RAY inspection system, function tester, etc. Location According to the need of detection, it can be configured in the appropriate place of the production line.8, repair: its role is to detect the failure of the PCB board rework. The tools used are soldering iron, repair workstation, etc. Configures anywhere in the production line.

Selective wave soldering, also known as robot welding, is a special form of wave soldering invented to meet the development requirements of through-hole components welding. Selective welding generally consists of three modules: flux spraying, preheating and welding. Through the device programming device, the flux spraying module can complete the selective flux spraying for each solder spot in turn, and after the preheating module is preheated, the welding module completes the welding for each solder spot point by point.

Why is SMT first Part tester so important for first part testing in SMT processing plants First of all, we need to know what are the factors that affect production efficiency in the production process? Affecting efficiency That must be the first confirmation process. A product with a low number of first pieces takes half an hour for first piece confirmation. A production model with many credits can take an hour, two hours, or even three hours to complete the first part confirmation process. In the current production process, such a first confirmation speed is far from meeting our production needs. How can we speed up our first confirmation? SMT intelligent first piece detector is a piece of detection instrument specifically for SMT first piece detection, through the combination of coordinates and BOM, as well as the display of high-definition pictures, directly reflect the material information of each position, do not need to query, operation directly by the operator to pick up the system prompts after the system automatically determines the detection result. This means of operation is simple, convenient and fast. Greatly improve the speed of your first confirmation, improve your production efficiency. How to ensure the quality of production? How do the problems of production quality come about? The more reason is that human operation is improper. Most of the time, we need to manually screen and delete the information given to us by customers, and the artificial operation will easily lead to wrong information, so that the wrong information is not detected in the process of the first detection. Lead to quality problems. The first detector does not require you to carry out redundant operations, and does not require you to go to the position information one by one. The data used by the first detector is generally required to be the original information provided by the customer, which comes from the customer, that is, the production form that the customer wants you to process. Therefore, when your first test is completed, the information is qualified, then, the product you produce now is the product that the customer requires to produce, so how can the quality not pass? Moreover, when your first piece detection is completed, the device can help you generate a first piece report, and you basically understand the process of the first piece operation when you watch the report. SMT first tester manufacturers What are the advantages of SMT first piece detector? SMT first piece detector can improve production efficiency, reduce labor costs, automatically judge test results, improve product quality, with traceability, strict process specifications, scan the SMT first piece PCB that needs to be tested, smart frame to obtain PCB physical scan picture, import BOM list and PCB component patch coordinates. The software intelligent synthesis and intelligent global coordinate calibration of PCB pictures, BOM and coordinates, so that the component coordinates, BOM and picture physical component position correspond one by one. By measuring the target through navigation, LCR reads the data to automatically correspond to the corresponding position and automatically judge the detection result. Avoid false test and leakage test, and automatically generate test reports stored in the database. After the continuous upgrading and improvement of the software, the system can also be applied to patch the missing parts of the material and realize the coordinate function of the coordinate meter to obtain the position coordinates of the chip components for the PCB.

Select the fundamental difference between wave soldering and ordinary wave soldering. Wave soldering is the contact of the entire circuit board with the spray surface relying on the natural climb of the surface tension of the solder to complete the welding. For large heat capacity and multilayer circuit boards, wave soldering is difficult to meet the requirements of tin penetration. The dynamic tin wave is flushed out of the welding nozzle, and its dynamic strength will directly affect the vertical tin penetration in the through hole. Especially for lead-free welding, because of its poor wettability, it needs a dynamic and strong tin wave. In addition, there is no residual oxide on the strong flow crest, which will also help to improve the quality of welding. The welding efficiency of selective wave soldering is indeed not as high as that of ordinary wave soldering, because selective welding is mainly for high-precision PCB boards, which can not be welded by ordinary wave soldering. When the traditional wave welding cannot complete the through-hole group welding (defined in some special products, such as automotive electronics, aerospace, etc.), at this time, the selective welding of each solder joint can be precisely controlled by programming, which is more stable than manual welding and soldering robot, and the temperature, process, welding parameters and other controllable and repeatable control; It is suitable for today's through hole welding more and more microform, welds-intensive products. Selective wave welding is lower than ordinary wave welding production efficiency (even 24 hours), production and maintenance costs are high, the key point yield is to look at NOZZLE status. Selective wave welding main attention: 1, nozzle state. The tin flow is stable, and the wave cannot be too high or too low. 2, the welded pin should not be too long, too long the pin will cause the nozzle offset, affecting the tin flow state.

1. Virtual weldingIt is a common welding defect that some IC pins appear in virtual welding after welding. Reason: pin coplanarity is poor (especially QFP, due to improper storage, resulting in pin deformation); Poor solderability of pins and pads (long storage time, yellow pins); During welding, the preheating temperature is too high and the heating speed is too fast (easy to cause IC pin oxidation). 2, cold welding It refers to the solder joint formed by incomplete reflux. Reason: insufficient heating during welding, insufficient temperature.3. BridgeOne of the common defects in SMT, which causes a short circuit between components and must be repaired when the bridge is encountered. Reason: solder paste collapse; Too much solder paste; The pressure is too large during the patch; Reflux heating speed is too fast, the solvent in the solder paste too late to volatilize. 4. Erect a monumentOne end of the chip component is lifted and stands on its other end pin, also known as the Manhattan phenomenon or suspension bridge. Reason: The fundamental is caused by the imbalance of the wetting force at both ends of the component. Specifically related to the following factors:(1) The design and layout of the pad is unreasonable (if one of the two pads is too large, it will easily cause uneven heat capacity and uneven wetting force, resulting in unbalanced surface tension of the molten solder applied to the two ends, and one end of the chip element may be completely wet before the other end begins to wet).(2) The printing amount of the solder paste in the two pads is not uniform, and the more end will increase the heat absorption of the solder paste and lag the melting time, which will also lead to the imbalance of the wetting force.(3) When the patch is installed, the force is not uniform, which will cause the component to be immersed in the solder paste at different depths, and the melting time is different, resulting in uneven wetting force on both sides; Patch time shift.(4) When welding, the heating speed is too fast and uneven, making the temperature difference everywhere on the PCB large. 5, wick suction (wick phenomenon)Resulting in a virtual weld, or bridge if the pin spacing is fine, is when the molten solder wets the component pin, and the solder climbs up the pin from the solder spot position. It mostly occurs in PLCC,QFP,SOP. Reason: When welding, due to the small heat capacity of the pin, its temperature is often higher than the temperature of the solder pad on the PCB, so the first pin wetting; The solder pad is poor in weldability, and the solder will climb.6. Popcorn phenomenonNow most of the components are plastic sealed, resin encapsulated devices, they are particularly easy to absorb moisture, so their storage, storage is very strict. Once the moisture is absorbed, and it is not completely dried before use, at the time of reflux, the temperature rises sharply, and the internal water vapor expands to form the popcorn phenomenon.7. Tin beadsIt affects the appearance and also causes bridging. There are two types: one side of a chip element, usually a separate ball; Around the IC pin, there are scattered small balls. Reasons: the flux in the solder paste is too much, the solvent volatilization is not complete in the preheating stage, and the solvent volatilization in the welding stage causes splashing, resulting in the solder paste rushing out of the solder pad to form tin beads; The thickness of the template and the size of the opening are too large, resulting in too much solder paste, causing the solder paste to overflow to the outside of the solder plate; When printing, the template and the pad are offset, and the offset is too large, which will cause the solder paste to overflow to the pad. When mounting, the Z-axis pressure causes the component to be attached to the PCB, and the solder paste will be extruded to the outside of the pad. When reflux, the preheating time end and heating rate are fast.8. Bubbles and poresWhen the solder joint is cooled, the volatile matter of the solvent in the internal flux is not completely dispatched. It is related to temperature curve and flux content in solder paste.9, solder joint tin shortageReason: printing template window is small; Low metal content of solder paste.10, solder joints too much tinCause: The template window is large.11, PCB distortionReason: PCB itself material selection is improper; PCB design is not reasonable, component distribution is not uniform, resulting in PCB thermal stress is too large; Double-sided PCB, if one side of the copper foil is large, and the other side is small, it will cause inconsistent shrinkage and deformation on both sides; The temperature in reflow welding is too high.12. Cracking phenomenonThere is a crack in the solder joint. Reason: After the solder paste is taken out, it is not used up within the specified time, local oxidation, forming a granular block, which is difficult to melt during welding and cannot be fused with other solders into one piece, so there is a crack on the surface of the solder joint after welding.13. Component offsetCause: The surface tension of the molten solder at both ends of the chip element is unbalanced; The conveyor vibrates during transmission.14, the solder joint dull lusterCause: The welding temperature is too high, the welding time is too long, so that the IMC is transformed into.15, PCB solder resistance film foamingAfter welding, there are light green bubbles around the individual solder joints, and in serious cases, there will be thumbnail-sized bubbles, affecting the appearance and performance. Reason: There is gas/water vapor between the solder resistance film and the PCB substrate, which is not completely dried before use, and the gas expands when welding at high temperature.16, PCB solder resistance film color changesSolder resistance film from green to light yellow, cause: the temperature is too high.17, PCB multi-layer board layeringCause: Plate temperature is too high.

Patch adhesive is a pure consumption of non-essential process products, now with the continuous improvement of PCA design and technology, through hole reflow, double-side reflow welding has been realized, the use of patch adhesive PCA mounting process is becoming less and less.SMT adhesive, also known as SMT adhesive, SMT red adhesive, is usually a red (also yellow or white) paste evenly distributed with hardener, pigment, solvent and other adhesives, mainly used to fix components on the printed board, generally distributed by dispensing or steel screen printing methods. After affixing the components, place them in the oven or reflow furnace for heating and hardening. The difference between it and the solder paste is that it is cured after heat, its freezing point temperature is 150 ° C, and it will not dissolve after reheating, that is to say, the heat hardening process of the patch is irreversible. The use effect of SMT adhesive will vary due to the thermal curing conditions, the connected object, the equipment used, and the operating environment. The adhesive should be selected according to the printed circuit board assembly (PCBA, PCA) process. Features, applications and prospects of SMT adhesive:SMT red glue is a kind of polymer compound, the main components are the base material (that is, the main high molecular material), filler, curing agent, other additives and so on. SMT red glue has viscosity fluidity, temperature characteristics, wetting characteristics and so on. According to this characteristic of red glue, in the production, the purpose of using red glue is to make the parts firmly stick to the surface of the PCB to prevent it from falling. Therefore, the patch adhesive is a pure consumption of non-essential process products, and now with the continuous improvement of PCA design and process, through hole reflow and double-sided reflow welding have been realized, and the PCA mounting process using the patch adhesive is showing a trend of less and less.SMT adhesive is classified according to the mode of use:Scraping type: The sizing is carried out through the printing and scraping mode of steel mesh. This method is the most widely used and can be used directly on the solder paste press. The steel mesh holes should be determined according to the type of parts, the performance of the substrate, the thickness and the size and shape of the holes. Its advantages are high speed, high efficiency and low cost.Dispensing type: The glue is applied on the printed circuit board by dispensing equipment. Special dispensing equipment is required, and the cost is high. Dispensing equipment is the use of compressed air, the red glue through the special dispensing head to the substrate, the size of the glue point, how much, by the time, pressure tube diameter and other parameters to control, dispensing machine has a flexible function. For different parts, we can use different dispensing heads, set parameters to change, you can also change the shape and quantity of the glue point, in order to achieve the effect, the advantages are convenient, flexible and stable. The disadvantage is easy to have wire drawing and bubbles. We can adjust the operating parameters, speed, time, air pressure, and temperature to minimize these shortcomings.SMT patch adhesive typical curing conditions:100℃ for 5 minutes120 ° C for 150 seconds150℃ for 60 seconds1, the higher the curing temperature and the longer the curing time, the stronger the bonding strength.2, because the temperature of the patch adhesive will change with the size of the substrate parts and the mounting position, we recommend to find the most suitable hardening conditions.The thrust strength requirement of the 0603 capacitor is 1.0KG, the resistance is 1.5KG, the thrust strength of the 0805 capacitor is 1.5KG, the resistance is 2.0KG, which can not reach the above thrust, indicating that the strength is not enough.Generally caused by the following reasons:1, the amount of glue is not enough.2, the colloid is not 100% cured.3, PCB board or components are contaminated.4, the colloid itself is brittle, no strength.Thixotropic instabilityA 30ml syringe glue needs to be hit tens of thousands of times by air pressure to be used up, so the patch glue itself is required to have excellent thixotropy, otherwise it will cause instability of the glue point, too little glue, which will lead to insufficient strength, causing the components to fall off during wave soldering, on the contrary, the amount of glue is too much, especially for small components, easy to stick to the pad, preventing electrical connections.Insufficient glue or leak pointReasons and Countermeasures:1, the printing board is not cleaned regularly, should be cleaned with ethanol every 8 hours.2, the colloid has impurities.3, the opening of the mesh board is unreasonable too small or the dispensing pressure is too small, the design of insufficient glue.4, there are bubbles in the colloid.5. If the dispensing head is blocked, the dispensing nozzle should be cleaned immediately.6, the preheating temperature of the dispensing head is not enough, the temperature of the dispensing head should be set at 38℃.The causes of over-wave soldering are very complex:1. The adhesive force of the patch is not enough.2. It has been impacted before wave soldering.3. There is more residue on some components.4, the colloid is not resistant to high temperature impact

1. The first is the quality of the steel mesh: the thickness of the steel mesh and the opening size determine the printing quality of the solder paste. Too much solder paste will produce bridging, too little solder paste will produce insufficient solder paste or virtual welding. The opening shape of the steel mesh and whether the opening wall is smooth also affect the release quality. 2, followed by solder paste quality: solder paste viscosity, printing rolling, service life at room temperature will affect the printing quality. 3. Printing process parameters: there is a certain restrictive relationship between the speed of the scraper, the pressure, the Angle of the scraper and the plate and the viscosity of the solder paste. Therefore, only by correctly controlling these parameters can we ensure the printing quality of solder paste. 4. Equipment accuracy: When printing high-density and narrow spacing products, the printing accuracy and repeat printing accuracy of the printing press will also have a certain impact. 5. Ambient temperature, humidity, and environmental hygiene: too high ambient temperature will reduce the viscosity of the solder paste, when the humidity is too high, the solder paste will absorb moisture in the air, the humidity will accelerate the evaporation of the solvent in the solder paste, and the dust in the environment will cause the solder joint to produce pinholes and other defects. It can be seen from the above introduction that there are many factors affecting the quality of printing, and the printing solder paste is a dynamic process. Therefore, the establishment of a complete set of printing process control documents is very necessary, the selection of the correct solder paste, steel mesh, combined with the most suitable printing machine parameter setting, can make the entire printing process more stable, controllable, standardized.

First of all, the plant disinfection, industrial safety inspection, fire inspection and other start inspections.Then please pay attention to the following: (1) Turn on the air conditioning of the plant in advance, and the temperature and humidity meet the requirements. (2) Open the workshop air source switch to confirm that the air pressure meets the requirements. (3) Confirm that the main power supply of the workshop equipment is turned off. (4) Confirm that the main power supply voltage of the workshop or production line meets the requirements, and turn on the switch. (5) Turn on the power of the device one by one. After the device is fully turned on, turn on the next device one by one. (6) After the equipment power supply is turned on, the origin is returned and the test mode heat engine is run. (7) Please follow the above procedures. If you have any questions, please contact the equipment manufacturer's after-sales phone or wechat. In order to reduce the post-holiday startup failure rate, SMT shares the following SMT equipment needs to pay attention to several matters First confirm whether the temperature and humidity of the SMT workshop exceed the environmental requirements, whether the equipment is damp, whether there is dew, do not rush to rise the temperature of the SMT workshop in a cold environment, the equipment is easy to produce dew. (At this time, it is forbidden to turn on the power supply) The specific practice refers to the SMT workshop environment of each factory according to the different degrees of moisture to the equipment for dehumidification treatment time selection, (industrial control electrical part to check whether it is normal) open the front and rear chassis covers of the equipment (pay attention not to touch the wire inside the corner), and place the fan in the front 0.5 meters of the chassis for blowing operations (purpose: Note: Do not use hot air), according to the degree of moisture to choose 2-6 hours of blowing operation, after the moisture removal operation, turn on the power, check that it is correct, but do not return to the origin, about 30-60 minutes after the boot in the back to the origin of preheating 1 Printing machineSolder paste printerSolder paste printing machine precautions 1, remove the scraper to clean the residual solder paste 2, after cleaning the screw guide rail, add special new lubricating oil 3, use the air gun to clean the dust of electrical parts 4, use the anti-seat cover protection phase 5, rail transport belt check whether it is replaced 6, whether the cleaning mechanism needs to be cleaned 7, the cylinder holding steel mesh mechanism is normal 8, check whether the gas path is normal 9, electrical industrial control Whether it is normal 2. Patch machinePoints to note for the placement machineFirst check whether the electrical part of the industrial control is normal, check whether there is no product falling off the track belt is damaged and deformed screw rod clean the dust and inject the special new lubricating oil nozzle air path is normal Feeder guide chute cleaning and maintenance Automatic change nozzle device clean and electrostatic inspection and maintenanceDischarge box cleaning in addition to static inspection and maintenance of universal machine backpack mechanism Cleaning inspection and maintenance of Feeder automatic refueling vehicle mechanism inspection and maintenance 3 Reflow welding reflow welding precautions 1, reflow welding machine annual maintenance 2, clean the residual components in the furnace, rosin; Transport chain cleaning and maintenance after adding high temperature chain oil, fine mesh belt inspection and maintenance. 3. Clean the hot air motor with an air gun. Dust on the heating wire, clean up the reflow electric box part, mainly the internal dust of the electric box, must add drying agent to avoid the electrical equipment being affected by 4, completely cut off the power supply of the equipment, be sure to confirm that the ∪PS power supply is off 5, confirm whether the fan is running normally 6, preheating area, constant temperature area, reflux area, Cooling zone four temperature zone system is normal 7, cooling zone flux recovery system inspection and maintenance 8, water inspection is normal 9, furnace seal device is normal 10, import and export cutting curtain inspection and maintenance 11, empty plate on the track to check whether the track deformation card phenomenon 1, completely clean up the welding residue of the spray device, blow off the welding aid, add alcohol, use the spray mode, clean up the welding aid pipe, nozzle, after cleaning, empty the alcohol to ensure that the machine is free of flux, alcohol inflammables 3, use the air gun to clean the hot air motor, heat wire dust, use the gun to clean the electric box part, mainly the internal dust of the electrical appliance. If necessary, add drying agent to avoid electrical appliances by the south 4, completely cut off the power supply of the equipment 5, industrial control electrical part is normal 6, track inspection and maintenance 5AOIAOI Precautions: 1, guide screw cleaning and maintenance add new butter 2, use air gun to remove part of the electrical dust, add desiccant in the electric box 3, clean and protect with dust cover 4, check whether the light source mechanism is normal 5, check whether the equipment movement shaft and motor are normal 6 Peripheral equipment loading and unloading machine business 1, screw column fill butter 2, use air gun to clean the electrical part of the dust, add desiccant in the electric box 3, the material frame down to the bottom of the shelf, clean the sensor dust.1, drive shaft, pulley cleaning, refueling 2, cleaning and cleaning sensor equipment users and managers after the first day of work need to do? On the first day back at work after a holiday, the core things that equipment users and managers need to do include adjusting their schedules, reviewing work plans, conducting safety checks and communicating with colleagues. ‌Firstly, ‌ adjusting work schedule ‌ is an important preparation for the first day back at work after the holiday. Device users and managers need to go to bed early and get up early, get enough sleep and avoid staying up late in order to feel energized for the new day ‌.Secondly, ‌ reviewing the work plan and objectives ‌ is also a necessary step. On the first day of work, take the time to review your work plan and goals, identify what you want to do in the New Year, and how to achieve the expected results. This helps to stay focused and increase productivity ‌.Equipment user1. Appearance inspection: Check whether the equipment has physical damage, such as scratches, cracks or corrosion. 2. Cleaning and maintenance: Remove dust, water, oil and other impurities from the equipment to keep the equipment clean. 3. Functional test: Carry out basic functional test on the equipment to ensure that all components can work normally. 4. Make the maintenance plan of the machine and equipment, and ensure the timely implementation, prevent equipment failure, improve production efficiency ‌.1. Safety device: Check whether the safety protection device of the equipment is in good condition, such as safety door, emergency stop button, etc. 2. Electrical inspection: Ensure the safety of electrical connections, gas path inspection, waterway inspection, no exposed wires or damaged plugs and other matters. 3. Check whether the factory production fire protection and ventilation are normal, and check the workshop environment and production supporting facilities.1. Calibration equipment: For precision equipment, such as test equipment, calibration is carried out to ensure that the measurement results are accurate. 2. Process parameters: Check and adjust the process parameters of the equipment to meet the production requirements.1. Lubrication maintenance: lubricate the parts that need to be lubricated to ensure smooth operation of the equipment. 2. Production material preparation: Prepare the materials required for production and ensure adequate supply. 3. Production consumables preparation: Prepare the consumables required for production to ensure adequate supply.1. Power operation: Observe the power status of the equipment before the formal no-load. 2. No-load operation: Before the formal production, carry out no-load operation test to observe the operating status of the equipment. 3. Trial production: small batch trial production, check the production capacity and product quality of the equipment. Record and report: 1. Record inspection: record the results of equipment inspection and testing, including any problems found and measures taken. 2. Information synchronization: Synchronize the device status and problems to the superior or related departments.Equipment manager1. Personnel management held a meeting of equipment users, emphasized equipment operation safety and precautions, and reminded employees to return to work as soon as possible. Understand the physical and mental state of employees to avoid fatigue and other situations.2, make plans according to the production plan, reasonable arrangement of equipment use and maintenance plan. Develop a response plan in case of emergency.3, safety inspection organization professional personnel to carry out a comprehensive safety inspection of the equipment. Pay special attention to the inspection of special equipment (such as pressure vessels, elevators, etc.) to ensure compliance with relevant regulations.4, the overall inspection of the equipment to check the maintenance records of the equipment to see if there are remaining problems to be dealt with. Inspection of all equipment, in addition to the content of the user inspection, but also pay attention to the overall operating environment of the equipment, such as whether the channel around the equipment is smooth, whether the fire equipment is in place. For key equipment and special equipment, it is necessary to focus on checking its safety and reliability, and arrange professional personnel to test if necessary.5, work arrangement according to the production plan and equipment status, reasonable arrangement of equipment use tasks, to avoid equipment overuse or idle. Ensure adequate supply of raw materials, accessories, tools, etc. required for equipment.Finally, ‌ and communicating with colleagues ‌ is also the key to a smooth start to the new journey. Sharing the mood and experience of the holiday and talking about the expectations for the next efforts can help relieve the tense working atmosphere, enhance the feelings among colleagues, and lay a good foundation for team cooperation

In the SMT entire line process, after the SMT machine completes the mounting process, the next step is the welding process, reflow welding process is the most important process in the entire SMT surface mounting technology. Common welding equipment includes wave welding, reflow welding and other equipment, and the role of reflow welding four temperature zones, respectively, are preheating zone, constant temperature zone, back welding zone and cooling zone. Each of the four temperature zones has its own significance.SMT reflow preheating area The first step of reflow welding is preheating, which is to activate the solder paste, avoid the preheating behavior caused by poor welding caused by rapid high temperature heating during tin immersion, and evenly heat the normal temperature PCB board to achieve the target temperature. In the heating process to control the heating rate, too fast will produce thermal shock, may cause damage to the circuit board and components; Too slow, the solvent volatilization is insufficient, affecting the welding quality. SMT reflow insulation area The second stage - insulation stage, the main purpose is to make the temperature of the PCB board and the components in the reflow furnace stable, so that the temperature of the components is consistent. Because the size of the components is different, the large components need more heat, the temperature is slow, the small components are heated up fast, and enough time is given in the insulation area to make the temperature of the larger components catch up with the smaller components, so that the flux is fully volatilized to avoid bubbles when welding. At the end of the insulation section, the oxides on the pad, solder ball and component pins are removed under the action of flux, and the temperature of the entire circuit board is also balanced. All components should have the same temperature at the end of this section, otherwise there will be various bad welding phenomena in the reflux section due to the uneven temperature of each part. Reflow back weld area The temperature of the heater in the reflow area rises to the highest, and the temperature of the component rises rapidly to the highest temperature. In the reflux street section, the peak welding temperature varies with the welding paste used, the peak temperature is generally 210-230 ° C, and the reflux time should not be too long to prevent adverse effects on the components and PCB, which may cause the circuit board to be scorched. Reflow cooling zone In the final stage, the temperature is cooled below the freezing point temperature of the solder paste to solidify the solder joint. The faster the cooling rate, the better the welding result. If the cooling rate is too slow, it will lead to the generation of excessive eutectic metal compounds, and the large grain structure is easy to occur at the welding point, so that the strength of the welding point is low, and the cooling rate of the cooling zone is generally about 4℃/S, cooling to 75℃.

1. Generally speaking, the temperature specified in the SMT workshop is 25±3℃;2. Materials and tools required for solder paste printing solder paste, steel plate, scraper, wiping paper, dust-free paper, cleaning agent, stirring knife;3. The commonly used solder paste alloy composition is Sn/Pb alloy, and the alloy ratio is 63/37;4. The main components of the solder paste are divided into two parts: tin powder and flux.5. The main function of flux in welding is to remove oxides, destroy the surface tension of melting tin, and prevent re-oxidation.6. The volume ratio of tin powder particles and Flux(flux) in the solder paste is about 1:1, and the weight ratio is about 9:1;7. The principle of using solder paste is first in first out;8. When the solder paste is used in opening, it must go through two important processes of warming and stirring;9. The common production methods of steel plates are: etching, laser, electroforming;10. The full name of SMT is Surface mount(or mounting) technology, which means surface sticking (or mounting) technology in Chinese;11. The full name of ESD is Electro-static discharge, which means electrostatic discharge in Chinese.12. When making the SMT equipment program, the program includes five parts, which are PCB data; Mark data; Feeder data; Nozzle data; Part data;13. Lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 melting point is 217C;14. The controlled relative temperature and humidity of the parts drying box is 90 degrees, it means that the solder paste has no adhesion to the wave welding body;51. When the humidity on the IC display card is greater than 30% after the IC is unpacked, it means that the IC is damp and hygroscopic;52. The weight ratio and volume ratio of tin powder and flux in the solder paste composition are 90%:10%,50%:50%;53. The early surface bonding technology originated in the military and avionics fields in the mid-1960s;54. At present, the most commonly used solder paste Sn and Pb content is: 63Sn+37Pb;55. The feeding spacing of the paper tape tray with a common bandwidth of 8mm is 4mm;56. In the early 1970s, the industry introduced a new type of SMD, called "sealed footless chip carrier", often abbreviated as HCC;57. The resistance of the component with symbol 272 shall be 2.7K ohms;58. The capacity of 100NF component is the same as that of 0.10uf;59. The eutectic point of 63Sn+37Pb is 183℃;60. The largest use of SMT electronic parts material is ceramic;61. The maximum temperature of the back-welding furnace temperature curve 215C is the most suitable;62. When inspecting the tin furnace, the temperature of the tin furnace 245C is more appropriate;63. SMT parts packing its coil type disc diameter 13 inches,7 inches;64. The open-hole type of steel plate is square, triangle, circle, star shape, this Lei shape;65. Currently used computer side PCB, its material is: glass fiber board;66. The solder paste of Sn62Pb36Ag2 is mainly used in the substrate ceramic plate;67. Rosin based flux can be divided into four kinds: R, RA, RSA, RMA;68. SMT segment exclusion has no directionality.69. The solder paste currently on the market has a stickiness time of only 4 hours;70. The rated air pressure of SMT equipment is 5KG/cm2;71. What kind of welding method is used when the front PTH and the back SMT pass through the tin furnace?72. SMT common inspection methods: visual inspection, X-ray inspection, machine vision inspection73. The heat conduction mode of ferrochrome repair parts is conduction + convection;74. At present, the main tin ball of BGA material is Sn90 Pb10;75. Production methods of steel plate laser cutting, electroforming, chemical etching;76. According to the temperature of the welding furnace: use the temperature gauge to measure the applicable temperature;77. The SMT semi-finished product of the rotary welding furnace is welded to the PCB when it is exported.78. The development course of modern quality management TQC-TQA-TQM;79. The ICT test is a needle bed test;80. ICT testing can test electronic parts using static testing;81. The characteristics of solder are that the melting point is lower than other metals, the physical properties meet the welding conditions, and the fluidity is better than other metals at low temperature;82. The measurement curve should be re-measured to change the process conditions of the welding furnace parts replacement;83. Siemens 80F/S is a more electronic control drive;84. Solder paste thickness gauge is the use of Laser light measurement: solder paste degree, solder paste thickness, solder paste printed width;85. The feeding methods of SMT parts include vibrating feeder, disc feeder and coil feeder;86. Which mechanisms are used in SMT equipment: CAM mechanism, side rod mechanism, screw mechanism, sliding mechanism;87. If the inspection section cannot be confirmed, the BOM, manufacturer's confirmation and sample plate shall be performed according to what item;88. If the part package is 12w8P, the counter Pinth size must be adjusted by 8mm each time;89. Types of welding machine: hot air welding furnace, nitrogen welding furnace, laser welding furnace, infrared welding furnace;90. SMT parts sample trial can be used: streamline production, handprint machine mount, handprint hand mount;91. Commonly used MARK shapes are: circle, "ten" shape, square, diamond, triangle, swastig;92. SMT segment due to improper Reflow Profile Settings, may cause parts micro-crack is the preheating area, cooling area;93. Uneven heating at both ends of SMT segment parts is easy to cause: air welding, offset, tombstone;94. SMT parts maintenance tools are: soldering iron, hot air extractor, suction gun, tweezers;95. QC is divided into :IQC, IPQC,.FQC, OQC;96. High speed mounter can mount resistor, capacitor, IC, transistor;97. Characteristics of static electricity: small current, affected by humidity;98. The Cycle time of high-speed machine and general-purpose machine should be balanced as far as possible;99. The true meaning of quality is to do it right the first time;100. The SMT machine should stick small parts first, and then stick large parts;101. BIOS is a basic Input/Output System. In English, it is: Base Input/Output System;102. SMT parts can not be divided into LEAD and LEADLESS two kinds according to the parts foot;103. The common automatic placement machine has three basic types, continuous placement type, continuous placement type and mass transfer placement machine;104. SMT can be produced without LOADER in the process;105. SMT process is board feeding system - solder paste printing machine - high speed machine - universal machine - rotary flow welding - plate receiving machine;106. When the temperature and humidity sensitive parts are opened, the color displayed in the humidity card circle is blue, and the parts can be used;107. Size specification 20mm is not the width of the material belt;108. Reasons for short circuit caused by poor printing in the process:a. The metal content of the solder paste is not enough, resulting in collapseb. The opening of the steel plate is too large, resulting in too much tinc. The steel plate quality is not good, the tin is not good, change the laser cutting templated. Solder paste remains on the back of Stencil, reduce the pressure of the scraper, and apply appropriate VACCUM and SOLVENT109. The main engineering purposes of the general backwelding furnace Profile:a. Preheating zone; Project objective: The capacitive agent volatilization in solder paste.b. Uniform temperature zone; Project purpose: activation of flux, removal of oxide; Evaporate excess water.c. Back welding area; Project purpose: solder melting.d. Cooling zone; Engineering purpose: alloy solder joint formation, part foot and pad joint as a whole;110. In the SMT process, the main reasons for tin beads are: poor PCB PAD design and poor steel plate opening design

The reflow furnace is the equipment with the largest power consumption in SMT. After expert testing, the energy consumption of the existing reflow furnace for work (heating PCB) is not very high, not exceeding 40% of the total energy consumption; Where did the other 60% go? The main energy consumption is analyzed as follows:1--> Body absorbs heat energy. 2--> Shell radiates heat. 3--> Heat energy taken away by cooling zone and exhaust gas. 4--> Power consumption of reflux fan, transmission network chain and control system. 5--> The heat convection imbalance in the temperature zone causes the heat lost from the inlet or outlet of the plate. Energy-saving technologies for reflow furnaces include:1. Use high temperature resistant ceramic fiber cotton to strengthen heat insulation of furnace.2. Adjust the airflow balance according to the temperature difference in the temperature zone.3. Install the energy-saving control system to automatically adjust the operating parameters according to the predetermined time of multiple stages during standby.4. Install a speed regulating device to control the speed of the reflux fan, and automatically adjust the speed for about 10 minutes on standby. The running speed of the motor will be reduced or stopped according to the actual situation, which will minimize the consumption and improve the power factor of the motor.5. Install the electric air valve to automatically control the opening and closing according to the working condition.

Reflow welding system is to extract high temperature air containing a lot of flux from the preheating zone, reflow zone and cooling zone, after external cooling system, the clean gas is sent back to the furnace. Notes for lead-free reflow curve setting 1, increase the preheating temperatureIn lead-free reflow welding, the preheating zone temperature of the reflow furnace should be higher than that of the preheating temperature of the tin/lead alloy reflow. It is usually about 30 ° C high, and the purpose of increasing the temperature of the preheating zone at 170 ° C-190 ° C (the traditional preheating temperature is generally 140 ° C-160 ° C) is to reduce the peak temperature to reduce the temperature difference between components.2. Extend the preheating timeAppropriate extension of the preheating time, preheating too fast on the one hand will cause thermal shock, is not conducive to reducing the temperature difference between the components in the formation of peak reflow temperature. Therefore, the preheating time of the preheating is properly extended, so that the temperature of the component to be welded smoothly rises to the predetermined preheating temperature.3, extend the trapezoidal temperature curve of the reflow zoneExtended trapezoidal temperature curve in the recirculation zone. While controlling the maximum reflow temperature, increase the temperature curve width of the reflow area, extend the peak time of small heat capacity components, so that the components with large and small heat capacity can reach the required reflux temperature, and avoid overheating of small components.4, adjust the consistency of the temperature curveWhen testing and adjusting the temperature curve, although the temperature curve of each test point has a certain dispersion, it is impossible to be completely consistent, but it should be carefully adjusted to make the temperature curve of each test point as consistent as possible.

What is the difference between lead-free reflow soldering and leaded soldering? First of all, we should understand that the whole process of lead-free welding is longer than that of lead welding, and the welding temperature required is also higher, mainly because the melting point of lead-free solder is generally higher than the melting point of lead solder, and the wettability will be worse. So, what do you need to pay attention to in the lead-free reflow welding process? Before the lead-free reflow welding begins, we first need to choose the right welding material, because in terms of its welding process, the selection of lead-free solder, solder paste, flux and other materials is particularly important and quite difficult. In the selection process of these materials, we need to take into account the type of welding components, the type of circuit board and its surface coating status, which are generally selected by experience.After selecting the welding material, we also need to choose the welding method, which generally needs to be selected according to the specific situation, such as in terms of component type, reflow welding method can be used for some surface mounted components, and wave soldering or spray welding can be selected for through hole inserted components. Here we also roughly introduce several common welding applications, for wave soldering, it is mainly suitable for some of the whole board through the hole insert components suitable for welding, dip welding method is more suitable for some of the whole board is relatively small, or there are parts of the board through the hole insert components when welding, Spray welding is more common in the welding of individual components on some plates or a small number of through-hole inserts. After the welding method is selected, the type of welding process is determined, at this time, we only need to select the equipment according to the welding process and the related process control wants to check together.In addition, the manufacturer of lead-free reflow welding also needs to continuously improve the lead-free welding process, so that the product can achieve higher requirements in quality and pass rate. For any lead-free welding process, changing its welding materials and updating equipment can effectively improve its welding performance.

As DeepSeek continues to be popular, people are not satisfied with the use of DeepSeek on the web and APP side, and try to localize DeepSeek. Localisation involves installing DeepSeek's large AI models on local computers, without relying on networks or cloud services. Reporters searched video websites and found that many users uploaded tutorials on how to deploy DeepSeek to local computers, and many videos were viewed more than 1 million times. DeepSeek sparks local deployment boom Teaching people to deploy DeepSeek has also become a business. Through searching for "DeepSeek local deployment" on the e-commerce platform, the reporter found that many shops have opened up DeepSeek local deployment business, and the unit price of these services ranges from a few dollars to dozens of dollars, and some of these services have recently been purchased by 1,000 people. An AI enthusiast who has tried to deploy told reporters that the response speed of the network side is slow, and when the traffic is too large, there is often "the server is busy, please try again later." In order to get a better experience, he tried to use DeepSeek for local deployment. It is understood that local deployment does not need to master deep programming knowledge, through the tutorial step by step, you can deploy successfully. Zhang Yi, chief analyst at IIMedia Consulting, told reporters: "Local deployment supports individuals to make some customized modifications to DeepSeek according to their needs, which is also one of the driving forces." Zhang Yi added that personal data in the local deployment does not go to the cloud, which can meet the privacy needs. DeepSeek published models with varying numbers of parameters, from as small as 1 billion parameters to as large as 671 billion parameters, and the larger the parameters, the greater the computational resources required. Due to the limited computing resources of devices such as personal computers and mobile phones, the 671 billion parameter DeepSeek model often cannot be deployed locally. "A typical laptop can only deploy a billion-parameter version, but a PC with a good GPU or high memory (say 32GB) can run a 7-billion-parameter version of DeepSeek." The AI technology enthusiasts told reporters. In terms of the effect of local deployment, the smaller the version of parameters, the worse the answer quality of the large model. "I tried the 7 billion parameter version of DeepSeek deployed locally, and it ran smoothly, but the answer quality was much worse than the cloud version, and the effect of the smaller parameter version was even worse." The above AI enthusiasts said. Under the heat of DeepSeek's local deployment, AI PCS that specifically add NPU to PCS are expected to usher in sales growth. It is understood that Huawei, Lenovo and other computer brands have launched AI PC, this new PC is equipped with specialized processing of local deployment of AI large model computing processor chips, these processor chips are provided by Intel, AMD, Qualcomm and other chip factories. These AI PCS can be deployed locally and run smoothly tens of billions of parameters of the AI large model, such as this CES 2025, AMD launched Ryzen AI max series processors, saying that the computer can run 70 billion parameters of the AI large model. However, the AI PC equipped with the processor chip is expensive, and it is understood that the price of an Asus game book is nearly 15,000 yuan. In addition, some people have questioned that spending a lot of money to buy AI PCS, carry out local deployment of AI large models, and achieve functions that are highly overlapping with cloud AI large models, AI PC is just a gimmick of manufacturers. Enterprises try to deploy DeepSeek locally In addition to individuals opening DeepSeek local deployment, enterprises are also beginning to try. On the first day of the working day of the Year of the Snake, Wang Jiahui, the founder of Timwei Ao, released a wechat circle of friends: "DeepSeek large model local computer deployment experience success, import coal mine knowledge safety database for questions and answers, the next step is to combine it with industrial field operations." Timviao is a company that provides industrial management solutions for the mining industry, oil industry and other industries, using AR glasses and AI software to provide real-time observation and guidance for the maintenance, quality inspection and troubleshooting of industrial field personnel. Wang Jiahui told reporters that only Tongyi Qian ask AI large model to create a local knowledge base question and answer, in view of DeepSeek better reasoning ability, he is considering DeepSeek and business deep integration. "On the basis of DeepSeek, we fine-tune specific parameters or secondary develop them to fit IT systems and implement new functions based on the needs and data of specific industrial scenarios." "Our goal is to deploy DeepSeek locally and interact with cameras in the field to better identify dangerous operations on site, and to implement functions such as hidden danger detection and product quality inspection," Wang told reporters. He believes that whether industrial customers adopt on-premises deployment depends mainly on the confidentiality of the data. "Some state-owned enterprises, military and medical equipment companies often ask us to implement local deployment solutions because they have high requirements for data security." He further added: "Non-secret scenarios can use cloud access solutions, although there will be operational delays, but the impact is small, and the solution price is lower." For on-premises deployments, these customers require servers equipped with 4-card or 8-card Gpus to implement DeepSeek local inference services. "My customers generally choose Nvidia's consumer graphics cards to configure their servers, such as the 4090, for better value for money." "If customers have domestic configuration requirements, we will buy more expensive domestic GPU graphics cards," Wang said. In addition to industry, more and more enterprises are starting to deploy DeepSeek locally. Sinolink Securities said that DeepSeek can be applied to information retrieval, document processing, industry research, market research and other scenarios. In addition, enterprises in the medical industry, network security and other industries have also recently deployed DeepSeek locally, including Wanda Information and Qihoo 360. Zhang Yi told reporters that as enterprises expand their requirements for localized deployment, the demand for domestic reasoning computing power will increase, and the United States bans high-end chips, domestic chip computing power companies will usher in greater opportunities. AI applications will explode Qualcomm CEO Cristiano Amon said that DeepSeek-R1 is a turning point for the AI industry, AI reasoning will migrate to the end side, AI will become smaller, more efficient, and more customized, and AI large models and AI applications based on specific scenarios will appear. China Aviation Securities Research report believes that DeepSeek-R1 shows that the end-to-end AI deployment will become more inclusive, and the era of all things intelligent will accelerate. Open source will entice more developers to build apps on top of DeepSeek. Domestic GPU cards such as Huawei Centeng, Moore Thread, Bishi Technology, and Daywise Core have been adapted to DeepSeek; Tencent Cloud, Alibaba Cloud, mobile cloud, Huawei Cloud and other cloud manufacturers also completed the adaptation with DeepSeek. The adaptation optimization of domestic computing power is expected to further reduce the cost of inference side. As the domestic app payment habit is not yet fully mature, the commercialization of AI applications may be hindered. Meng Can, chief of National Finance Computer, believes that the United States has a 10-year or even 20-year basis for application payment, which is helpful for the commercialization of AI applications, while the domestic market will be slow due to the lack of such a foundation. However, the country is constantly catching up, and the time schedule is expected to be reduced to less than half a year.

IPC APEX EXPO 2019 Premier Electronics Industry Conference and Exhibition Dates: Saturday, January 26, 2019 - Thursday, January 31, 2019 Venue: San Diego Convention Center, San Diego CA, United States

Riyadh, 9 February 2025 - Alat Enat, an innovative company committed to transforming global industries by creating a world-class manufacturing hub in Saudi Arabia, and global technology leader Lenovo Group today held a groundbreaking ceremony for a new manufacturing base in Riyadh. Located within the Riyadh Complex campus operated by the Saudi Special Integrated Logistics Zone (SILZ), the new facility will cover an area of 200,000 square meters and will be designed, built and operated with a high standard of sustainability, with an expected annual production capacity of millions of "made in Saudi Arabia" laptops, desktops and servers. After obtaining shareholder and regulatory approval, the two parties announced on January 8 the completion of the three-year US $2 billion non-interest-bearing convertible bond investment and the strategic cooperation agreement announced in May 2024. This important development marks a solid step forward in the strategic cooperation between the two parties, and Lenovo's growth in Saudi Arabia and the Middle East region is expected to accelerate again. Amit Midha, CEO of Alat Enet, attended the ceremony with Yang Yuanqing, CEO of Lenovo Group.Yang Yuanqing (sixth from left), CEO of Lenovo Group, and Amit Midha (fifth from left), CEO of Alat Enat, lay the foundation stone of the new plant in RiyadhAccording to the plan, the new plant is expected to start production in 2026 and will be located in the Saudi Special Integrated Logistics Zone (SILZ), just a 15-minute drive from Riyadh International Airport. When completed, the plant will become an integral part of Lenovo's global manufacturing network with manufacturing sites in more than 30 markets, including China, Argentina, Brazil, Germany, Hungary, India, Japan, Mexico and the United States. At the same time, the new facility will enhance the resilience and flexibility of its global supply chain, while providing more agile service to customers in the Middle East and Africa region. Lenovo Group has been praised for its excellence in global supply chain operations and has been ranked among the top supply chains in various industries around the world - ranked 10th in Gartner's Global Supply Chain Top 25 list. The new facility in Riyadh will further expand Lenovo's presence in the region, bringing industry-leading products, services and solutions to the local market more quickly, and taking full advantage of the high growth opportunities in the information technology and enterprise services industry in the Middle East and Africa. This strong strategic partnership and investment will help Lenovo further strengthen its global presence and fully grasp the huge growth opportunities in Saudi Arabia and the Middle East - Africa region. We are very pleased to form a long-term strategic partnership with Alat Enat, and with our leading global supply chain and innovation capabilities, Lenovo will help Saudi Arabia achieve its Vision 2030 of economic diversification, industrial development, technological innovation and job growth."-- Yang Yuanqing, Chairman and CEO of Lenovo Group We are very proud to be a strategic investor in Lenovo Group and work with them to help them continue to maintain their leading position in the global technology industry. Alat and Lenovo have also entered into a business development and expansion agreement to leverage Alat's extensive local network and rich market insights. With the establishment of Lenovo's regional headquarters in Riyadh and a world-class manufacturing base in Saudi Arabia powered by clean energy, we look forward to seeing Lenovo further unlock its potential in the Middle East and Africa region."-- Amit MidhaAlat, CEO of Ennett On the same day, Yang Yuanqing also attended LEAP 2025, the largest science and technology event in the Middle East, in Riyadh. Yang Yuanqing said at the opening ceremony, "Lenovo Group will also set up its regional headquarters for the Middle East and Africa in Riyadh and establish a new flagship retail store to be closer to local customers." We are proud to embark on a new chapter of growth, innovation and collaboration, and look forward to working with all parties to build a smarter future."Yang Yuanqing attended LEAP 2025, the largest technology event in the Middle East, held in RiyadhThe Middle East and Africa market is becoming a competitive hot spot for global IT companies, and Saudi Arabia is the economic and technological hub of the Middle East region. This year's LEAP 2025 has attracted many of the world's leading technology companies, including Lenovo Group, to participate in the exhibition, and the Middle East craze continues to heat up.Yang Yuanqing attended LEAP 2025, the largest technology event in the Middle East, held in RiyadhThe investment of Lenovo Group and Alat Enat in Saudi Arabia will greatly contribute to the achievement of Saudi Arabia's economic goals and is highly aligned with the strategic plan of Saudi Arabia's Public Investment Fund (PIF) and Saudi Arabia's Vision 2030. The partnership is expected to create up to 15,000 direct jobs and 45,000 indirect jobs, laying a solid foundation for sustainable growth and national development in Saudi Arabia. By 2030, the cooperation between the two sides is expected to contribute $10 billion to Saudi Arabia's non-oil GDP. The Lenovo investment is one of Alat Enat's many investment plans through 2030, aiming to build on Saudi Arabia's rapid development momentum in the technology sector and enhance the kingdom's capabilities in this field. Alat Enat will also further empower private enterprises and optimize the business environment through its own business systems and partnerships with leading global technology manufacturers. Today, Alat is focusing on building innovation and manufacturing capabilities in nine business segments, including semiconductors, smart devices, smart buildings, smart appliances, smart healthcare, electrification, advanced industries, next generation and AI infrastructure. The company will produce 34 product categories in these nine areas and has hired top global industry experts to lead each business segment.

Dear customers and friends,We are pleased to announce the arrival of our new 2023 JUKI JUKI RS-1R units, feeders, multi-function trays and accessories. If you have any questions, please feel free to contact our customer service team, we will be happy to serve you.Buy it now! Make Yamaha a weapon in your production and enjoy a quality experience just like before! If the part number is not listed on our website, please email: liyi@gs-smt.comWe will give you a quote as soon as possible!

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First, stable performance Samsung chip machine has a great guarantee in terms of performance in the use and work project, and it has achieved good optimization in terms of efficiency and time when working, and has also achieved stability protection. In terms of problems, there are fewer errors and problems, they rarely occur, or they can be solved quickly once they occur. This is an advantage that other SMT machines lack. It is also a prominent feature of Samsung chip machine. Second, the equipment is tough In terms of the performance of the equipment, Samsung chip mounters have high guaranteed quality, both in terms of hardware basis and software. Compared with other brands of chip mounters, the use time of the equipment is relatively long, and the consumption of the use is relatively small. Therefore, the problems caused by the maintenance work in the later stage of the product are relatively less, which is the basic advantage of the equipment. It is also a more important aspect, because the performance of the equipment is to ensure all work. Third, price advantage Although Samsung chip mounters have advantages compared with other brands in quality and work efficiency, they will not be higher than them in price, but have a very affordable price and are willing to be accepted by people, which is an important aspect to ensure that Samsung chip mounters are prominent in the market competitiveness, and it is also an aspect that we often value when choosing chip mounters. Fourth, after-sales service Mechanical equipment is generally used for a long time, and there will be more or less some problems in the process of use, these problems and problems in the Samsung chip machine has been a good solution.

At the end of January, Tesla CEO Elon Musk told investors that the company would launch a "profit-oriented driverless taxi service" in Austin, Texas, by June this year. Tesla has few regulatory restrictions in Texas, raising questions about the safety and legal risks it will take by deploying unproven driverless technology on public roads. Tesla has long blamed customers for accidents involving driver-assistance systems Autopilot and "full Autopilot" (FSD), and has reminded Tesla owners to be ready to take over the vehicle when the system is activated. Now Musk has promised to launch true driverless taxis, a move that legal experts say would make Tesla fully liable in the event of a traffic accident. For a decade, Musk has promised to launch a fully self-driving Tesla car, but has never been able to deliver. Those promises have become more frequent and the timeline tighter in recent months as Musk has shifted Tesla's focus from selling affordable electric cars to developing and deploying self-driving vehicles. However, Musk's vague rhetoric has left investors wondering when Tesla will actually launch fully autonomous driving technology, how big and what the business model will be. To date, Tesla has never demonstrated this technology on public roads. Tesla and Musk did not respond to requests for comment. Current Texas law does not prohibit Tesla from launching a driverless taxi service. The hands-off approach to regulation is in line with Musk's growing opposition to government intervention as an adviser to US President Donald Trump. Under Texas law, self-driving companies are free to operate on public roads as long as they are registered and insured like human-driven cars, but they must be equipped with technology that can record data on any potential accidents. There is no state agency that licenses or regulates driverless taxi services, and state law prohibits cities and counties from setting their own regulations for driverless cars. Texas Senator Kelly Hancock is the sponsor of the Texas Autonomous Driving Act of 2017. He said the Texas legislature wanted to promote the industry in a competitive market and avoid creating barriers with too many restrictions. "As a conservative, I want to minimize government intervention," he said. "We can't kill an industry by having different regulations in every place." In contrast, California has strict regulations on the operation of self-driving cars, and Musk moved Tesla's headquarters from California to Austin, Texas, in late 2021. So far, only two companies have been approved to operate paid driverless taxi services in California: General Motors' Cruise and Alphabet's Waymo. Both companies completed millions of miles of testing under strict supervision before they were allowed to carry passengers. Cruise has suspended its driverless taxis. In an earnings call held on January 29, Musk said he expected to release an "unsupervised" version of the FSD system in California this year. However, two California agencies that oversee the industry say Tesla has not applied for the permits required to operate driverless cars or carry passengers, and has not submitted test data to the state since 2019. California does not specify how much testing self-driving technology must undergo before it is approved, but other companies that have gone through the process have completed millions of miles of self-driving car testing under state supervision. State records show that since 2016, Tesla has submitted just 562 miles for testing. Musk's challenge Mr Musk announced his latest plans for driverless taxis on the same day that Tesla reported disappointing earnings that failed to meet analysts' expectations. This follows news that Tesla suffered its first sales decline in 2024. Still, Tesla shares rose 3% the next day. Musk has promised that Tesla will launch a "driverless taxi service" in Austin in June. Musk said he expects to roll out an "unsupervised" version of the FSD system later this year in California and "many areas across the United States." But he did not explain whether that meant a driverless taxi service, a feature that Tesla owners could buy, or some other service. Musk did say that the "unsupervised" version of the FSD system would be able to drive "without a human driver." Musk did not say how many cars would be deployed, how customers would use them or whether the service would be open to everyone. Brian Mulberry, client portfolio manager at Zacks Investment Management, a Tesla investor, said the rhetoric often leaves investors guessing about exactly what Tesla will launch and when it will be delivered. "That's the challenge for Musk: you're sort of playing divination with tea leaves, trying to figure out from a few words what's going to happen," he said. Musan also said he's not particularly worried about the promises and timelines Musk has made this year, as long as Tesla can show progress: "I think the blueprint is there." Bryant Walker Smith, a law professor at the University of South Carolina who studies autonomous driving, said Texas does not require "pre-approval" before Tesla can deploy driverless cars. However, after Tesla's Cybercab demonstration at a Los Angeles movie studio in October failed to live up to expectations, Smith expressed doubt that Tesla would deploy self-driving technology on a large scale in Texas or elsewhere. "Tesla is not going to make all its vehicles autonomous overnight in any environment," he said. According to Smith, Tesla is more likely to try a small scale test of the technology in an area of Austin, Texas, perhaps in good weather or through manual remote control to avoid crashes. "There should be many ways to operate," he said. "We have no power." Adam Hammons, a spokesman for the Texas Department of Transportation, said the state allows self-driving cars to be tested and operated on public roads "as long as they meet the same safety and insurance requirements as other vehicles." The proliferation of driverless cars on Austin's streets over the past two years has raised concerns among residents and authorities after a series of near-fatal accidents involving pedestrians, cyclists and other vehicles. In 2023, more than 20 Cruise driverless taxis caused a traffic jam near the University of Texas campus when the vehicles failed to meet and blocked an entire street. Gm declined to comment. Since July 2023, the city of Austin has received 78 formal complaints from law enforcement, first responders and residents. City officials said the complaints may not have fully documented all incidents involving the vehicles. A resident complaint in December said a Waymo vehicle blocked a lane for half an hour, causing "at least three incidents." "I cannot believe that you would allow potentially lethal technology to be tested on the citizens of this city," the complaint added. A Waymo spokesperson said the company has been working with local leaders and first responders to "earn the trust of the Austin community" and is constantly working to improve service. A spokesman for the Austin Department of Transportation and Public Works said police have also run into difficulties, with driverless cars unable to recognize traffic officers' command gestures and the city unable to issue tickets to the cars. Recently, the city proposed a way for police officers to file a complaint in municipal court when they spot a traffic violation. The spokeswoman said Tesla contacted Austin officials in May, and city officials provided information about local fire and police procedures, maps of areas around schools and school districts, and traffic rules during special events. Austin City Council member Zo Qadri is frustrated with the city government's inability to set rules against "private companies occupying public roads for testing," especially in downtown areas where driverless taxis are common. "The bottom line is we have no power.

"During the Spring Festival alone, nearly 100 investment institutions asked people to introduce them to see if there was an opportunity to invest in DeepSeek." In the face of the phenomenon of DeepSeek, a large model released by domestic AI companies, an angel investor admitted to the Surging news reporter, "We need to think about why projects like DeepSeek were previously missed by us." DeepSeek technology boom triggered a global shock, the stock prices of many technology giants on the other side of the ocean plunged, and artificial intelligence leader Nvidia fell 4.3 trillion yuan in market value overnight. "DeepSeek does not have a promotional budget, nor does it have an annual salary of 10 million people, it is a clear goal to invest in research and launch products." The above investor comments. Another large model unicorn told reporters that "DeepSeek founder Liang Wenfeng is a person with AI beliefs, and the technical romanticism he insists on is very well-known in the industry." "Don't miss the next DeepSeek because you follow DeepSeek, what we need is not a rush to pursue and imitate, the era of artificial intelligence will force humans to return to the source of value." Fudan University School of Computer Science and technology professor, Shanghai Key Laboratory of data science director Xiao Yanghua told reporters. In his view, behind the rise of DeepSeek is the epitome of China's AI power, and a group of artificial intelligence startups similar to DeepSeek are standing on the world stage. Why DeepSeek broke through "DeepSeek was out of my reach last year. Now it's out of my reach." Tao Ru, an algorithm engineer at an AI company in Shanghai, told Surging news reporters with a smile that as an algorithm graduate of a top domestic university, he had received an olive branch from DeepSeek last year, but finally gave up because he was worried that the company was not well-known enough and would not focus on AI. On social media, many fresh graduates have shown DeepSeek's job invitation, and the words are quite regrettable. Also "missing" DeepSeek there is a circle of investment institutions, "DeepSeek company executives are clearly not interested in commercialization, just want to do technical research." Investment institutions need to commercialize the company, have revenue profit and capitalization requirements for the company, and also need the founder to surrender a certain degree of equity and freedom." An investor admitted that, in fact, no practitioner of AI investment does not know DeepSeek, and some people extended an olive branch before the explosion. But the end result is that no VC (venture capital firm) has successfully invested in the company. Some people who know DeepSeek told reporters that they had interviewed some talents in the field of AI, and finally rejected their own company and went to DeepSeek, on the grounds that they had a good scientific research atmosphere and were a team that really did things. "In terms of salary package, DeepSeek is only in the middle of the industry, not the highest." He admitted, "The density of talent may not be as good as the head of the big factory, not that the people in the big factory are not smart, but the smart people in the big factory spend too much energy outside of technology." "Big companies pay well, but their internal struggles are fierce, and the desire to focus on technology is not as pure as a technology company like DeepSeek." "DeepSeek's popularity was due to chance, but more to necessity." Xiao Yanghua told reporters. "The parent company behind it, Magic Capital, has strong technical strength and computing power foundation in the field of quantitative trading and intelligent finance. At the end of 2022, when OpenAI just launched ChatGPT, there were few domestic clusters of Wanka, except magic Square. In addition, the convergence of a large number of AI-related talents in the financial field also gives DeepSeek a deep talent advantage." "It's more about the change in mindset." Xiao Yanghua admitted that most AI companies in the past were eager to achieve success, busy with brush list, publicity, realization and capital accounting, while DeepSeek was calm and focused on technical exploration, allowing the team to drive research and development based on curiosity, and was not eager to commercial realization. In terms of environmental factors, Hangzhou, where DeepSeek is located, has an advanced innovation environment. The government has created an atmosphere of tolerance, trial and error and exploration, and only built platforms without interfering with the innovation direction of enterprises, which is very conducive to the development of enterprises. Tan Jian, associate professor of intelligent interaction design at Beijing University of Posts and Telecommunications, believes that the key changes brought by DeepSeek mean that, as the cost of the model decreases, in the future, high-level AI applications will be promoted by small and medium-sized enterprises, and form a "hundred flowers" situation, and in the short and medium term, cloud computing, edge computing, and server three types of manufacturers. "At present, the three major operators and many Internet computing service platforms have connected to DeepSeek and provided Internet access, and it can be predicted that the revenue of these traditional cloud services and computing platforms will rise steadily as the entire population registers AI services." DeepSeek is not the only Chinese DeepSeek's explosion also lets the outside world see that China has formed a number of powerful and influential companies in the large model industry, including ByteDance, Ali, Tencent and other large factories, and there are start-ups such as Moon's dark side, Wisdom spectrum and MiniMax. On the first day of the New Year after DeepSeek hit the whole network, Ali Yuntongyi team released its flagship model "Qwen2.5-Max", becoming the second Chinese large language model that can match the o1 series of OpenAI company in the United States, which once again caused a shock. According to the ranking of the third-party platform, "Qwen2.5-Max" ranked 7th in the overall list with 1332 points, surpassing the deep search "DeepSeek-V3" and OpenAI's "o1-mini". In math and programming, "Qwen2.5-Max" ranked first and second in Hard prompts. The AI unicorn "Dark Side of the Moon" was established in April 2023, and its legal representative Yang Zhilin graduated from Tsinghua University. He earned a doctorate from Carnegie Mellon University in the United States and started his own business in Beijing. According to third-party data, as of January, the company valuation on the dark side of the month has reached $3.3 billion. MiniMax, a Shanghai-based AI unicorn, was founded in December 2021 with large multi-modal models of text, voice, music, images and video. A highlight worth noting is that MiniMax is at the forefront of the country in terms of AI going to sea. The latest data show that MiniMax's Conch AI overseas version topped the global AI video list in December last year, with more than 27 million monthly visits. Liu Hua previously told surging news reporters that the United States is in a leading position in AI large model technology as a whole, and in voice, video and other segments, China's large model catch-up speed is fast, such as conch AI and Kuaishou's large model are widely used in the United States, and at present in these fields, the technical level of the two countries has reached a stage of equal. "In fact, the rate of iteration and evolution of large model technologies in the United States today is actually slower than before." Liu Hua said, "At present, the leading enterprises in the United States have or are building 100,000 card clusters. There are even plans to build million-card clusters to train more advanced models. However, the realization of the million-card cluster faces many challenges, among which whether the local large-scale power facilities support is one of the key factors." Against this backdrop, Chinese companies are rapidly catching up with their American rivals. DeepSeek is like a "catfish", once again stimulating the vitality of AI competition. "The large model field has not yet formed an absolute moat, the industry is still in the early stage of development, and there is still a long way to go from the mature stage." Chen Cheng, a veteran observer of the AI industry, told Surging news reporters that he guessed that competition and internal volume in the large model industry would be further intensified after DeepSeek exploded. "The fierce competition between manufacturers, the most benefit is undoubtedly the user of the large model, that is, the ordinary user, they will enjoy the continuous evolution of the large model capability, the continuous improvement of the cost of the dividend." A well-known AI company told reporters that DeepSeek is not perfect, v3 model mainly in mathematics and code and other capabilities are more prominent, other general class text generation, understanding and other effects have room to improve, on its particularly low training costs, does not include all costs. (Editor's note: v3's published training cost is about $5.576 million. A third party report points out that the $5.576 million figure mainly refers to the cost of the GPU for model pre-training, and does not include other important costs such as R&D, data collection, and cleaning.) "After the explosion of DeepSeek, it will undoubtedly stimulate all parties in the industry to further invest in benign technology competition, which is extremely beneficial to the development of the entire industry." At present, in the large model circuit, companies are working hard to achieve better performance, and this dynamic competitive atmosphere is very rare." Another AI startup insider admitted to reporters that "at this stage, who will fall behind and who can stand out are still unknown." In order to survive and develop in the competition, we will definitely invest more resources, and the whole industry is full of vitality and development potential." How does the DeepSeek effect work Hu Yanping, chief expert of FutureLabs FutureLab, said that DeepSeek has become an effect, including four aspects, namely, the cost effect of computing power, the user detonating effect, the confidence boosting effect and the open source ecological effect: "Next, there will be a new phenomenon, many slightly strong related enterprises will be based on the base of the large model to do a variety of post-training, distillation fine-tuning, combined with knowledge base, etc., and then to face thousands of industries, forming a large model industry in the AI 2.0 era of the back of the market." Based on this observation, Hu Yanping believes that the AI industry has three potential directions next: the first direction is the end of the first cycle of AI 2.0 represented by the large language model, and the second cycle represented by multi-modal, embodied intelligence, space-time intelligence, etc.; The second direction is the aftermarket of AI large models, that is, the ecological emergence of the waist and long tail; The third direction is end-to-end AI agents, especially those that can be integrated with workflows and individual needs. In Xiao Yanghua's view, many AI startups have a good university background, and there is no shortage of talent and funds, but there is a general problem of mental anxiety, too eager, but not conducive to original innovation. "Companies need a more relaxed development atmosphere and develop steadily according to their own pace and strategic direction." He believes that, in fact, governments around the world are now very concerned about AI companies, but the lack of truly excellent, take out of hand enterprises, "the government's concern should be moderate, after building a good environment and platform, there will be no more intervention." "Caring too much can disrupt the pace of business. It's more important to be a smart carer." In addition, the emergence of DeepSeek, proved that AI enterprises rely on burning money volume "investment flow" "customer" path is not feasible, the past Chinese AI large model "volume" computing power, "volume" price, "volume" customer, "volume" liquidity ability, now people more recognize the original innovation of long-term, enterprises should think about structural innovation and low-cost research and development, Instead of burning money. "Big AI models are a very risky investment track with huge amounts of money, and only a few companies will survive, which means that many investments in companies will fail." The vice president of a large model enterprise told the Surging news reporter that in the current environment, the US dollar fund cannot achieve the traditional "investment and financial tube withdrawal" path because of the reason of fund-raising limitation, "the large model industry must accept a reality, and the government will guide the foundation to play a more important role." From a formal point of view, he suggested that you can refer to the current domestic and international computing power coupons. For example, now the state-owned enterprises can establish a computing power cluster to provide computing power for large model enterprises, and after the investment, most of the investment funds will be returned to the hands of state-owned enterprises in the form of computing power leasing fees. Xiao Yanghua believes that the wave of entrepreneurship set off by the large model industry means that private enterprises and small and micro enterprises play an important role in the national science and technology innovation system, and will drive more enterprises to flourish in the future. "Enterprises are often the most curious and creative in the start-up and small and micro stage. Curiosity is like a precious spark. It is so precious that the whole society should take good care of it so that the seeds of innovation can continue to take root and grow in the right soil."

1. PrepareMaterial inspection: Ensure that the material of the material belt and the material receiving belt is consistent, and the parameters such as thickness and width meet the requirements. Tools: Prepare the tools required for the material connecting belt, such as scissors, adhesive tape, pliers, and hot press. Clean working area: Ensure that the working area is clean to avoid dust or impurities affecting the quality of the material. 2. Cut material beltCutting Angle: The material belt is usually cut at a 45 degree Angle to increase the contact area and improve the connection strength. Cutting accuracy: Ensure that the cutting edge is smooth to avoid burrs or unevenness. 3. Butt tapeAlign the strips: Align the two strips precisely to ensure the same width and thickness. Fixed material belt: Use receiving pliers or jigs to fix the material belt to prevent movement. 4. Connection modeAdhesive tape connection: Use special adhesive tape to bond the two sections of material tape. Make sure the tape covers the entire joint and apply appropriate pressure to ensure a strong bond. Hot pressing connections: For connections requiring higher strength, a hot press can be used for hot pressing. Make sure the temperature and time are set properly to avoid overheating or underheating. Ultrasonic welding: suitable for some special materials, through ultrasonic vibration to generate heat, so that the material is welded together. 5. Check and testAppearance inspection: Check whether the joint is smooth and there are no bubbles, wrinkles or unbonded parts. Strength test: Tensile test is performed to ensure that the joints can withstand the tension during production. Electrical testing (if applicable) : If the tape is used for electronic components, perform an electrical connectivity test to ensure that the joint conducts electricity well. 6. Record and markRecord receiving information: record receiving time, operator, materials and tools used for easy traceability. Mark the joint position: clearly mark the joint to facilitate subsequent process identification and processing. 7. Safety precautionsOperation safety: Pay attention to safety when using tools to avoid cuts or burns. Environmental safety: Ensure that the working area is well ventilated, especially when using glue or hot pressing, to avoid inhaling harmful gases. 8. Follow-up ProcedureStorage conditions: The connected material belt should be stored in a dry, dust-free environment to avoid moisture or pollution. Pre-use inspection: Before using the connected material belt, check the joint again to ensure that there are no quality problems. Through the above steps, you can ensure the quality and reliability of the material and tape joint to meet the production needs.

Production standard1. Appearance quality standardJoint smoothness: The joint should be flat, without obvious bumps, wrinkles or warping.No air bubbles or impurities: There should be no air bubbles, foreign objects or glue residue in the joint.Edge alignment: The edges of the two sections of tape should be aligned, the width is the same, and the deviation is usually not more than ±0.1mm.Uniform tape coverage: If the receiving tape is used, the tape should completely cover the joint, and there is no offset or leakage.2. Dimensional accuracy standardWidth consistency: the width of the material belt at the seam should be consistent with the raw material belt, and the deviation should not exceed ±0.1mm.Thickness consistency: The thickness of the joint should be consistent with the raw material belt, avoid being too thick or too thin, usually the deviation does not exceed ±0.05mm.Length error: the total length after feeding should meet the requirements, and the error is controlled within ±1mm.3. Mechanical performance standardsTensile strength: The tensile strength at the joint should reach more than 90% of the raw material belt to ensure that it will not break during the production process.Flexibility: The joint should have a certain degree of flexibility and be able to withstand a certain amount of bending and stretching without cracking.Peel strength: If the tape is used to connect, the peel strength between the tape and the material should meet the requirements, usually not less than 2N/mm.4. Electrical performance standards (if applicable)Electrical conductivity: If the tape is used for electronic components, the resistance at the joint should be consistent with the raw material tape, with a deviation of not more than ±5%.Insulation: If the tape needs insulation, there should be no leakage or short circuit at the joint.5. Environmental adaptability standardsTemperature resistance: The joint should be able to withstand temperature changes in the production environment, usually requiring no failure within a certain temperature range (such as -20 ° C to 80 ° C).Moisture resistance: The joint should have a certain moisture resistance to avoid opening or failure in a high humidity environment.Chemical resistance: If the tape comes into contact with chemicals, the joints should be resistant to chemical corrosion.6. Process consistency standardConnection position: The connection position should meet the process requirements and avoid connection in key areas (such as the location of precision components).Receiving length: the length of the receiving belt should meet the production requirements to avoid too long or too short affecting the production efficiency.Frequency of connection: minimize the number of connection times to avoid frequent connection affecting the overall quality of the material belt.7. Reliability test standardsTensile test: Tensile test is performed on the joint to ensure that it can withstand the tension during the production process.Bending test: Perform multiple bending tests on the joint to ensure that it does not crack or fail.Burn-in test: Simulate a long time use environment to test the durability of joints.8. Record and traceability standardsReceiving records: record receiving time, operator, materials and tools used for easy traceability.Quality inspection record: record the quality inspection results of each receiving material, including appearance, size, strength and other data.9. Safety and environmental standardsMaterial environmental protection: Bonding tape and glue should meet environmental requirements and do not contain harmful substances (such as RoHS standards).Operation safety: Tools and materials used in the feeding process should meet safety standards to avoid injury to operators.

SPI: Software and hardware collaborative upgrade, suitable for silver pulp printing detection! Intelligent vision leads the future of detection01 Using DLP digital raster projectors - high precision imaging, diverse algorithms The traditional mechanical grating projectors have limited accuracy and insufficient flexibility in detection. In practical applications, SPI using DLP optical structure projectors has the ability of high speed, high resolution and high contrast detection. Range optimization: When the solder paste height is greater than the range range, there will be a situation where the imaging does not match the actual height. After the upgrade, the measuring range is upgraded from 0-600um to 0-1100um, with a large measuring height range and high imaging restoration degree. Beautiful image After image beautification, 3D point cloud has no obvious sawtooth and has better sinusoidal property 02 One person multi-machine remote review - saving labor costs Solder paste test will be checked by statistical Process Control (SPC) tool to predict the solder paste printing process trend. This SPI model upgrade rewritten SPC software to realize one person control multiple machines, save labor costs, make the production process smoother and improve the overall production efficiency.Before the upgrade: Each device on the production line is separately equipped with a computer, and a corresponding number of operators are required to conduct real-time data monitoring, recording and exception processing. After the upgrade: The "one-to-one" monitoring method has been changed, and only one person can centrally monitor and manage data. 03 Optimize the zero plane calculation method -- adapt to complex application scenarios The calculation method of zero plane is very important to ensure the accuracy of detection. The traditional SPI system may face the problem of zero plane misjudgment caused by complex scenes such as impurities around the solder paste, background color, reflectivity and geometry, which will affect the precision of solder paste detection. 04 Customer case: Detection imaging display -- silver pulp printing detection The application of SPI technology to the detection of silver paste printing is also a highlight of this innovative application. Silver paste is a key material connecting substrate and chip. The upgraded SPI height detection accuracy (correction module) is 1um, and repeatability (volume/area/height) is

In the production process of the electronic manufacturing industry, the uncleaned residue on the pcb will indirectly affect its short-term and long-term functional reliability, ‌ residue will gradually harden and form metal halate and other corrosion with time, ensuring the cleanliness and cleaning timelessness of the pcb is a link that cannot be ignored in quality improvement. ▲ There are tin beads between the solder joints of each small board 01 Tin bead cleaning machine details - functions and characteristics In order to meet the requirements of automatic cleaning after welding, Jingtuo launched a tin bead cleaning machine, the general standard configuration is composed of two modules: transmission and cleaning. By connecting and selecting the welding equipment programming device, each welding spot can be programmed in turn, and the cleaning module can complete the cleaning of each welding spot. X/Y/Z axis movement, separate cleaning parameters Tin bead cleaning machine: integrated with selective welding Brush head diameter 10mm-30mm optional, flexible, to meet the cleaning needs of different scenarios The large brush head has a wide coverage, can carry out a comprehensive cleaning work, easily reach and clean up a large area, accelerate the cleaning process, and its design can effectively prevent tin beads splash, protect the surrounding environment from pollution. The small brush head focuses on high-precision cleaning, removing hard-to-reach stains and residues in subtle places, especially when cleaning small gaps in precision instruments, leaving no dead corners. The combination of the two not only improves cleaning efficiency, but also ensures a high standard of cleanliness, helps the production process proceed smoothly, and ensures product quality and safety. 02 Selective wave soldering - the complete process from operation to cleaning Selective wave welding is modular design, flexible configuration, can be freely expanded, connected with tin bead automatic cleaning machine as a cleaning module in the selection of welding, to achieve spray, preheating, welding, cleaning integration. Spray module system Used for flux spraying to prevent oxidation of liquid solder and heated metal in contact with oxygen in the air; Precision spray flux system with rosin spray detection function and rosin flow monitoring can be configured with two independent spray modules, spray width up to 2~8mm, programmable spot spray and line spray. Preheating module system After the PCB board is sprayed with flux, it will reach the preheating zone to heat and activate the flux. The preheating module is mainly equipped with the top hot air and the bottom infrared heater, and the power heating mode is also configured for the PTH complex process PCB. To ensure efficient, safe and uniform heating. Welding module system After entering the welding zone from the preheating zone, the machine will position the pcb and start welding. The welding module is driven by electromagnetic pump. It can be configured with double tin cylinder to meet the production demand. At the same time, it has nitrogen protection to ensure durable and reliable welding. Tin bead cleaning module system After the welding is completed, the cleaning module will clean the residual tin beads on the welding plate. The roller brush was used to clean the solder bead of PCB solder pad. Through software control, components are positioned and cleaning parameters are controlled. The cleaning parameters of each solder joint can be set independently to achieve point-by-point cleaning of each solder joint, and can be repeated cleaning, repeated positioning accuracy up to ±0.15mm. 03 Customer case: Welding quality display -- practical application and results Selected welding spray, preheating, welding, cleaning modules work together to achieve a high-quality production process, in practical application cases, after welding products in appearance or performance, can meet customer expectations. Application scope is not limited to: military electronics, aerospace ship electronics, automotive electronics, digital products and other high welding requirements and complex process of multi-layer PCB through hole welding. PCB cleanliness high PTH solder joint dialysis 100% By introducing automatic cleaning technology for tin beads, we not only take into account the cleanliness of the production line, but also ensure the enhancement of welding quality and product reliability. Looking forward to the future, Jintuo will continue to uphold the spirit of innovation, constantly broaden the horizon, in-depth exploration of diversified application scenarios and emerging market opportunities, and is committed to transforming cutting-edge technology into an inexhaustible driving force for the vigorous development of the electronics manufacturing industry.

Development of nitrogen applications In the early 1970s, nitrogen was found to be able to create an inert environment, effectively preventing the reaction with oxygen, and it was gradually used in the field of electronics manufacturing;With the rise of surface mount technology (SMT) in the 1990s, welding quality and reliability were inseparable from low-oxygen environments, and manufacturers began to standardize the use of nitrogen in reflux processes.Today, the trend of miniaturization and precision of electronic components continues to drive the demand for nitrogen applications, and nitrogen reflow has long been the preferred configuration in high-quality electronics manufacturing. How to achieve accurate nitrogen flow control The nitrogen closed loop system is an automated control system used to control the oxygen concentration range within the required PPM value during the welding process, ensuring a low or no oxygen environment in the welding. ▲ Write the PPM value to be controlled in the nitrogen setting interfaceThe control value is then written into the oxygen separator ▲ Proportional valve closed-loop system controls the nitrogen flowmeterThe nitrogen input can be adjusted without manual operation The nitrogen closed-loop system effectively avoids nitrogen consumption and cost increase due to inaccurate nitrogen control flow rate. And frequent adjustment of welding parameters caused by rework, thereby reducing production efficiency. ▲ PPM change curve: When the input set value is 500The control accuracy of the full closed-loop control sampling oxygen separator is effectively controlled within the range of ±50ppm The actual process improvement brought about by low oxygen environment In practical applications and tests, the following welding processes can be improved by using a nitrogen closed-loop system. Finer crystal structure The solder joint surface is bright Reduce fine-pitch bridging Reduce oxidizing spot welding Cavity rate reduction At present, the KT series reflow welding has realized the quantitative control of nitrogen in the whole process, and the independent closed-loop control of each temperature zone, so that the oxygen concentration range is controlled in 50-200ppm ▲KT full series nitrogen consumption diagram The nitrogen closed-loop system significantly improves the stability and reliability of the welding process. We firmly believe that with continuous technological progress and process optimization, we can continue to maintain advantages in the fierce competition and provide customers with higher quality products and solutions.

With the increasing influence of PCBA components on the external environment such as physical damage, chemical corrosion, wet oxidation, electrical short circuit and dust, this makes the performance requirements of PCB in electronic products further improved, the three anti-paint coating process is an important process in the production of electronic products, by coating a thin layer of insulating protective layer on the surface of PCB board. Isolate electronic components from the external environment. At present, PCB board coating three anti-paint has become a general trend, in communications, automotive, military electronics, aerospace, medical electronics and other industries are widely used; It can greatly reduce the repair situation, improve the quality of circuit boards and components, and effectively improve the safety, durability and reliability of electronic products. Veneer coating line: high efficiency production, high quality technology Most of the traditional veneer coating lines on the market use tunnel horizontal furnaces, which generally have problems such as large footprint, high energy consumption, low performance, and unstable quality, and can not meet the needs of the new era of factory heating and curing equipment in production and operation. In view of the drawbacks of the horizontal furnace, the company has devoted itself to designing a new coating line process plan, replacing the horizontal furnace with the vertical curing furnace, which has the characteristics of high automation, high production efficiency, low energy consumption, and saving labor costs The process diagram of veneer coating wire body Compared with the traditional line body, it saves 40% of the floor space, improves the production efficiency by 50%, and is more suitable for the production capacity of the factory. Precise temperature control The curing furnace has 6 groups of independent heating modules, each module has independent temperature control, and the temperature in the furnace is stable, which makes the baking and curing performance better and ensures nearly perfect quality. Temperature test diagram Run smoothly The single-layer load inside the furnace chamber can reach 30kg, and the imported optical fiber sensor is used to accurately locate the product position and ensure the smooth operation to the maximum extent. Internal ascent operation indication Jintuo shares: hand in hand, to the future Through the effective management of each link, to achieve independent research and development, independent production. Vertical curing furnace has also gained the unanimous praise and support of the head communication technology company, which reflects the customer's affirmation of the product strength, and also represents the recognition of the market and customers for the comprehensive strength of Jingtuo in the field of electronic thermal engineering.

In recent years, the development of artificial intelligence has advanced by leaps and bounds, and with the continuous progress of technology and the continuous expansion of application scenarios, it has gradually penetrated into the field of industrial visual inspection; The deep learning AI algorithm with higher computing efficiency and higher detection rate came into being, which makes up for the shortcomings of traditional algorithms that cannot detect complex features, and realizes the quality and intelligence of enterprise production to a greater extent. What is AI deep Learning Algorithm Deep Learning is an important branch of machine learning. It mainly imitates the way human brain analyzes and processes information, trains machines to extract common patterns among these instances in case learning, draws a deep learning model containing features and expressions in data, and automatically learns the mapping relationship from input to output from data. It helps to quickly classify the acquired information in the future. Intelligent upgrade AI technology enables AOI visual inspection Based on the deep learning algorithm, the company independently developed a new visual AOI detection equipment. On the basis of the traditional detection method, the AI deep learning algorithm realized the auxiliary programming of AOI, omitting the steps of the traditional manual frame debugging, which greatly simplified the programming process; At the same time, it has a more intelligent detection ability, which can accurately locate and classify different forms of solder joints and various types of welding problems, and can also detect characters on the components, eliminate the interference caused by blur or light, and accurately identify characters. Jingtuo AOI visual inspection equipment diagram Now it has been widely used in SMT, THT, and other process production lines. SMT production line THT production line Auxiliary programming With the help of deep learning algorithm, the AI model is generated by importing different forms of picture data for training, and the location of the measured object is accurately located in each detection, and the measured object can be automatically classified according to the training data. Automatic solder joint identification Intelligent detection Through the AI deep learning algorithm, the characteristic information of the defect is identified and the problem type of the detected object is correctly judged. Intelligent identification of welding problems OCR(Optical Character Recognition) Character detection is a form of detection that utilizes deep learning, and in the industrial world, character recognition is a machine vision task that involves extracting text from images. Jintuo AOI visual inspection equipment with pre-training font library, quickly identify picture information. OCR character recognition In the review process, the deep learning system can perform a second review of the AOI test results, effectively avoid errors in the manual review and lead to quality instability, reduce the manual review workload, and increase the straight-through rate of the production line by 5%-10%. Intelligent review diagram Since the introduction of deep learning algorithm in AOI vision inspection equipment, production efficiency and inspection flexibility have been effectively improved; The innovative development of visual inspection has promoted the development of lithium batteries, consumer electronics, automobiles, aerospace and other fields to intelligent manufacturing. In the future, Jingtuo will continue to focus on cutting-edge technologies, launch products that meet market trends and needs, and help the automation and intelligent upgrading of the manufacturing industry. Relevant recommendation

With the in-depth development of a new round of scientific and technological revolution and industrial change, intelligent manufacturing is leading the direction of global manufacturing development and change, in the field of electronics manufacturing, PCBA circuit board SMT and DIP production equipment intelligence is a key link in the transformation and upgrading of electronic manufacturing enterprises, which is conducive to improving the traditional manufacturing industry model and reducing labor costs. Improve production efficiency and yield of electronic products. The DIP furnace post-inspection and repair process is an important node to improve the production efficiency of the entire production line. Starting from the post-wave welding section, the equipment is followed by the connection station, AOI, selective wave welding, AOI, involving testing, spraying, welding and other processes. At present, there are several problems in the furnace repair line on the market1, PCB bad detection of high misjudgment, low straight-through rate 2, the selection of welding using the mechanical origin positioning method, resulting in tooling errors, mechanical errors, so that the tin nozzle can not be accurately positioned to the bad solder joints 3, for different defect categories, need to manually set parameters Especially in the current trend of miniaturization and precision of electronic components, the problems on the market have restricted the improvement of production efficiency, in the new generation of post-furnace repair program, for improving the detection accuracy rate, reducing the defective rate, improving the level of production line automation and other needs to improve, effectively improve the repair efficiency, the repair yield increased to 99.95%. AOI detection improves accuracy AOI inspection equipment equipped with high performance industrial cameras, no need to flip over, seamless docking wave soldering production line, to meet the high-speed DIP process capacity. Combined with a multi-spectral ultra-high-speed programmable optical system, multiple images are captured per detection field, which helps to accurately identify undesirable features. The AOI test has higher detection and lower false positives than the traditional post-furnace repair line. AOl detects the bad position and type of the product solder joint, and transmits the coordinates of the bad spot to selective wave soldering to realize information interconnection. Optimization of repair yield by selective wave soldering Selective wave soldering for spray, preheating, welding integration design, small footprint, low energy consumption, high production efficiency. Instead of the traditional mechanical origin positioning method, the solder joint positioning is based on the PCB position, and the bad coordinate information transmitted by AOI is read It can set individual parameters for each solder joint according to the information in the component library, and automatically repair bad solder joints without the use of manual. Precision spray flux system with spray test function and flow level monitoring, spray speed up to 20mm/s, positioning accuracy of ±0.15mm, accurate target through hole positioning. The spraying of flux helps to remove oxides from metal surfaces and prevent reoxidation, while increasing welding firmness. The dynamic preheating at the bottom is combined with the hot air preheating at the top, and the preheating division control system gives full play to the maximum energy efficiency ratio, effectively preventing the warping and deformation of the circuit board caused by uneven heating at different positions. ▲ Blue is the welding preheating temperature curve, the heating speed is fast, the temperature is high The smooth crest can make the soldering effect better, Jingtuo choose welding using electromagnetic drive to control the crest system, to achieve a stable crest state, with 3-axis servo control system, accurate positioning of the need to repair the solder joint area. AOI secondary inspection maximizes control quality After selective wave soldering, the repaired PCB will be tested twice, and the qualified PCB will be sent to the blanking machine, and the unqualified PCB will be sent to the selective welding again by the defective product distributor. The AOI responsible for the secondary inspection will also pass the detected bad spot information to the selective welding, and the defective PCB will be repaired twice by the selective welding The secondary repair provides guarantee for the yield of the product, improves the process of the front section, and achieves the goal of zero defects in the production line. In the context of intelligent manufacturing enabling manufacturing industry to improve the quality and upgrade, Jinto based on the independent research and development of technical achievements, composed of post-furnace inspection and repair automation solutions, safe and efficient, fully automatic testing, to comprehensively improve the production efficiency of the electronic manufacturing industry; All along, Jintuo has been committed to providing high-quality intelligent solutions for the comprehensive upgrading of PCBA electronic manufacturing industry chain, and achieving quality improvement, cost reduction and efficiency improvement in new energy vehicles, medical devices, communications electronics, aerospace and other industries. Strengthen the basic support capacity of advanced manufacturing, and help the manufacturing industry to transform and upgrade to intelligent manufacturing.

In the rapid development of the electronics manufacturing industryThe functional application of Jingtuo turntable type selective welding closely matches the market trend Welding parameters personalized Settings With the diversification of demand for electronic products, electronic manufacturing enterprises small batch, multi-variety production demand gradually increased, different from the traditional batch production mode, rotating disk welding can be set according to different product types and specifications, quickly adjust the process parameters, improve production flexibility. Precision welding and positioning control With the increasingly rich functional characteristics in many products, there are higher requirements for the accuracy and stability of welding on PCB, rotary disk welding can achieve welding accuracy of ±0.05mm, spray positioning accuracy of ±0.05mm, rotary disk accuracy of ±0.1mm, to avoid dislocation or deviation in the welding process, reduce welding defects. It plays a vital role in improving the overall performance of the product. Compared with traditional selective weldingWhat are the advantages of rotating disk selective welding?Under the requirements of electronic manufacturing enterprises to improve production efficiency, reduce costs and improve product quality, rotary type selective welding has more prominent advantages, compared with the traditional selective welding, more efficient, energy saving, flexible and other characteristics. 01Rotating disk station weldingThe floor area is reduced by 60%, and the space utilization is high 02Spray and weld simultaneouslyThe dual-zone movement time is shortened to less than 1.5s, and the efficiency and productivity are high 03Single point high precision nozzleThe amount of solder used is small and the energy consumption is lowReduce the waste of energy and materials and meet environmental requirements Complete in one stepNew welding process upgrade Driven by the continuous deep cultivation and innovation of the R & D team, the product performance has been continuously upgraded, and AOI testing, six stations operating at the same time, spray, welding, and testing integration has been realized. ▲ Six stations operate at the same time ▲ Spray & Welding &AOI testing integration To better meet the needs of customers for production efficiency, to achieve a full range of quality control, to achieve zero discharge of defective products, leading the new direction of welding technology. We are well aware of the pulse of the market, understand the needs of customers, so the turntable welding can not only meet the high standards of the electronics manufacturing industry, but also adapt to the innovation and development of industry technology; In the future, Jintuo will continue to actively explore new application scenarios and market opportunities, and inject new vitality and momentum into the development of the electronics manufacturing industry.

【 March 7, 2023, Zhuhai 】 -- Today, the high-profile SMT Training Center was officially inaugurated in Zhuhai. The center, jointly established by Fulo Trading /Global Soul Limited, aims to train highly qualified SMT (surface mount technology) professionals for the electronics manufacturing industry and contribute to the sustainable development of the intelligent manufacturing industry.Focus on the needs of the industry to create a professional training platformWith the rapid development of the global electronics manufacturing industry, SMT technology as the core process of modern electronic product manufacturing, the demand for highly skilled personnel is growing. The establishment of SMT training center is precisely to cope with this industry challenge, for enterprises to transport SMT technical personnel with a solid theoretical foundation and rich practical experience.The center is equipped with international leading SMT production line equipment, including automatic placement machine, reflow furnace, AOI testing equipment, etc., to provide students with real production environment simulation. At the same time, the center also invited a number of industry experts and senior engineers as instructors, combining theory and practice, to provide students with a full range of training courses. School-enterprise cooperation to promote the deep integration of industry, university and researchThe establishment of SMT training Center is an important practice of school-enterprise cooperation. As a leading Global electronics manufacturing service provider, Global Soul Limited has extensive industry experience and technology accumulation. Fulo Trade has deep teaching resources and scientific research strength in the field of vocational education. The two sides have jointly created this high-level training platform.At the opening ceremony, Fong Wenfeng, Chairman of Fulo Trading, said: "The establishment of the SMT Training Center is an important move for us to fulfill our social responsibility and promote the development of the industry. We hope that through this platform, we can train more high-quality technical talents for the industry and help China's intelligent manufacturing go to the world. Diversified curriculum system to meet the needs of different levelsThe SMT Training Center has designed a diversified curriculum system to meet the needs of students at different levels. Both beginners and experienced practitioners can find a training program that suits them here. The course covers SMT basic theory, equipment operation and maintenance, process optimization, quality management and other aspects to ensure that students can fully master the core skills of SMT technology.In addition, the center also provides customized enterprise training services to help enterprises improve the technical level of employees, optimize production processes, and improve production efficiency.Looking forward to the future, to help the industry high-quality developmentThe establishment of SMT training center not only injected new vitality into the electronic manufacturing industry, but also provided new ideas for the development of vocational education. In the future, the center will continue to deepen school-enterprise cooperation, expand training areas, explore more innovative models, train more high-quality technical talents for the industry, and help the high-quality development of China's intelligent manufacturing. About SMT Training CenterSMT Training Center is a professional training organization of Global Soul Limite and Zhuhai Fulo, dedicated to training highly skilled SMT technical talents for the electronics manufacturing industry. With advanced equipment and professional teachers, the center provides diversified training courses to help students achieve career development and promote technological progress in the industry.Media Contact:Global Soul LimitedAttn:Yi LeeMobile:+86-13662679656Address: Room 3B016,B Block,Hao Yun Lai Bussiness Building , Liutang road ,Bao'an District,Shenzhen,Guangdong,China