UF 120LA: The next generation of highly reliable 100% compatible flux residuals and reworkable filling materials.

YINCAE has launched the UF 120LA, a high-purity liquid epoxy filling material designed for advanced electronic packaging. The UF 120LA has excellent fluidity and can fill narrow gaps up to 20 μs, avoiding cleaning processes and thus reducing costs and environmental impact while ensuring superior performance in applications such as BGA, flip chips, WLCSP and multi-chip modules. The UF 120LA can withstand five 260°C reflux cycles without distortion of the solder joint, surpassing competitors that require cleaning. Its ability to cure at lower temperatures increases production efficiency and makes it ideal for use in memory cards, chip carriers and hybrid integrated circuits. The superior thermal performance and mechanical durability of the UF 120LA enable manufacturers to develop more compact, reliable, and high-performance devices, driving the trend toward miniaturization, edge computing, and Internet of Things (IoT) connectivity. This technological advancement will enhance the production of critical applications such as 5G and 6G infrastructure, autonomous vehicles, aerospace systems and wearable technology, where reliability and durability are critical. In addition, by streamlining the manufacturing process, the UF 120LA accelerates the speed to market of consumer electronics, potentially reshaping supply chain efficiency and creating new opportunities for economies of scale. In the long term, widespread adoption of this technology could revolutionize the field of semiconductor packaging, laying the foundation for increasingly complex electronic devices that will be lighter, more efficient, and more resilient in extreme environments. Key Benefits: • No cleaning compatibility - Compatible with all non-cleaning solder paste residues. Cost savings - eliminate cleaning processes and pollution control. • High thermal reliability - can withstand multiple reflux cycles without deformation. • Excellent fluidity - narrow gaps up to 20 μs can be filled. • Low warpage - low CTE and high thermal stability. "The UF 120LA represents a significant advance in electronic packaging technology," said YINCAE Chief Technical Officer. "The UF 120LA enables manufacturers to push the boundaries of advanced packaging applications, from BGA to wafer-scale chip-scale packaging. We believe this product will set new industry standards for performance and efficiency.