Reflow - full nitrogen control technology

In the process of welding in an aerobic environment, secondary oxidation will occur, resulting in poor wetting, especially in the miniaturization and close spacing process, which will lead to more deadly hazards: voids, which easily lead to a decrease in the strength of the solder joints of micro-components; Tin ball, easy to lead to short circuit between closely spaced components; Virtual welding affects the electrical performance and service life of the product. HB reflow low oxygen concentration control technology is specifically designed for expensive components, double-sided assembly, micro-spaced components, small volume components, high temperature solders, and production processes that require high reliability for welding. The results show that in nitrogen environment, the surface tension of liquid solder decreases and the wetting Angle increases by 40%. Increase wetting capacity by 3-5%; Wetting time can be reduced by 15%; Effectively reduce peak temperature and shorten reflux time. In the SELEIT reflow nitrogen system, the oxygen concentration can be independently controlled throughout the whole process, which effectively solves the above problems.