SPI: Software and hardware collaborative upgrade, suitable for silver pulp printing detection! Intelligent vision leads

SPI: Software and hardware collaborative upgrade, suitable for silver pulp printing detection! Intelligent vision leads the future of detection
01 Using DLP digital raster projectors - high precision imaging, diverse algorithms

The traditional mechanical grating projectors have limited accuracy and insufficient flexibility in detection. In practical applications, SPI using DLP optical structure projectors has the ability of high speed, high resolution and high contrast detection.

Range optimization: When the solder paste height is greater than the range range, there will be a situation where the imaging does not match the actual height.

After the upgrade, the measuring range is upgraded from 0-600um to 0-1100um, with a large measuring height range and high imaging restoration degree.

Beautiful image

After image beautification, 3D point cloud has no obvious sawtooth and has better sinusoidal property

02 One person multi-machine remote review - saving labor costs

Solder paste test will be checked by statistical Process Control (SPC) tool to predict the solder paste printing process trend. This SPI model upgrade rewritten SPC software to realize one person control multiple machines, save labor costs, make the production process smoother and improve the overall production efficiency.
Before the upgrade: Each device on the production line is separately equipped with a computer, and a corresponding number of operators are required to conduct real-time data monitoring, recording and exception processing.

After the upgrade: The "one-to-one" monitoring method has been changed, and only one person can centrally monitor and manage data.

03 Optimize the zero plane calculation method -- adapt to complex application scenarios

The calculation method of zero plane is very important to ensure the accuracy of detection. The traditional SPI system may face the problem of zero plane misjudgment caused by complex scenes such as impurities around the solder paste, background color, reflectivity and geometry, which will affect the precision of solder paste detection.

04 Customer case: Detection imaging display -- silver pulp printing detection

The application of SPI technology to the detection of silver paste printing is also a highlight of this innovative application. Silver paste is a key material connecting substrate and chip. The upgraded SPI height detection accuracy (correction module) is 1um, and repeatability (volume/area/height) is <1μm@3sigma, providing more reliable quality assurance for semiconductor packaging process.

SPI as a key quality inspection tool, performance upgrade is an important driving force to improve the welding effect, Jingtuo as a commitment to improve product quality, adhere to independent research and development, independent innovation of the excellent enterprise model, the future will also be forward-looking vision and unremitting efforts to jointly promote the innovation and development of industrial visual inspection technology.