Advanced 14-layer printed circuit board with 1-level High Density Interconnect technology, designed for complex electronic applications requiring superior performance and reliability.
Key Specifications:
• Board Thickness: 2.0mm
• Material: Shengyi TG170
• Surface Finish: Gold Plating
• Impedance Control: Standard
• Line Spacing: 3/3mil
• Via Technology: Laser Drilling
Technical Features
High Density Interconnect (HDI) technology for compact designs
14-layer construction for complex circuit routing
Precision laser drilling for micro vias
Impedance controlled signal integrity
Gold surface finish for enhanced conductivity and corrosion resistance