Name: 8 Layers 1.6mm Thick FR4 Sheng Yi TG170 Plate Soft and Hard Bonding PCB for High-Performance Applications
Brand: Global Soul Limited
SKU: GS8CRYJHB
Availability: InStock

Home > Products > SMT PCB Manufacturing >

8 Layers 1.6mm Thick FR4 Sheng Yi TG170 Plate Soft and Hard Bonding PCB for High-Performance Applications

Hard Bonding Board

8 Layer Bonding Board

Soft Bonding Board

Place of Origin:

China

Brand Name:

Model Number:

GS8CRYJHB

Document:

Product Brochure PDF

Request A Quote

8 Layers 1.6mm Thick FR4 Sheng Yi TG170 Plate Soft and Hard Bonding PCB for High-Performance Applications

Product Details

Highlight:

Hard Bonding Board

8 Layer Bonding Board

Soft Bonding Board

Payment & Shipping Terms

Minimum Order Quantity

1 PCS

Price

USD+negotiable+pcs

Packaging Details

20*20*10cm

Delivery Time

5-15 days

Payment Terms

T/T

Supply Ability

1+pcs+per days

Professional 8 Layer Control Panel PCB with 1.6 Thick Shengyi TG170 for SMT Manufacturing

Get Best Price

Multilayer PCB 4.0mm Thick 8 Layer Circuit Board with 3/3mil Line Width for High-Density Interconnect

Get Best Price

4 Layers High Frequency PCB with Rogers +FR4 Composite for Superior High Speed Performance

Get Best Price

8 Layers 1 Level HDI Light Board PCB with 2.0mm Thickness for High-Performance Applications

Get Best Price

Contact Now

Product Description

8 Layer Soft and Hard Bonding Board for PCB Manufacturing

Advanced 8-layer rigid-flex PCB combining FR4 and polyimide materials for high-reliability applications in demanding electronic environments.

Product Specifications

Layer Configuration: 8-layer soft and hard bonding

Board Thickness: 1.6mm

Material Composition: FR4 Sheng Yi TG170 plate + soft board PI communication board

Minimum Hole Size: 0.2mm maximum

Key Features

Combined rigid and flexible circuit design
High-temperature performance with TG170 material
Precision drilling capabilities down to 0.2mm
Enhanced reliability for complex electronic applications
Ideal for communication and high-frequency applications

PCB Manufacturing Capabilities

Specialty PCB High-frequency PCBs Heavy copper PCB Impedance controlled PCB Ceramic PCB RF circuit boards Blind and buried vias Multi-layer special PCB Carbon ink PCB Flexible circuit boards Metal core PCB High-temperature PCBs Custom PCB design Thick copper PCB Specialized PCB applications High-reliability PCBs Low-loss PCB materials PCB manufacturing techniques Prototype special PCBs Advanced PCB fabrication

Tags：

8 Layers 1.6mm Thick FR4 Sheng Yi TG170 Plate Soft and Hard Bonding PCB for High-Performance Applications

Hard Bonding Board

8 Layer Bonding Board

Soft Bonding Board

Hard Bonding Board

8 Layer Bonding Board

Soft Bonding Board

Professional 8 Layer Control Panel PCB with 1.6 Thick Shengyi TG170 for SMT Manufacturing

Multilayer PCB 4.0mm Thick 8 Layer Circuit Board with 3/3mil Line Width for High-Density Interconnect

4 Layers High Frequency PCB with Rogers +FR4 Composite for Superior High Speed Performance

8 Layers 1 Level HDI Light Board PCB with 2.0mm Thickness for High-Performance Applications

High Precision 5G Communication Board

PCB Manufacturing 5G Communication Board

5G Communication Board PCB Manufacturing

6 Layer High-Density Interconnect SMT PCB for Semiconductor Testing with Advanced PCB Fabrication Process

Professional 8 Layer Control Panel PCB with 1.6 Thick Shengyi TG170 for SMT Manufacturing

Multilayer PCB 4.0mm Thick 8 Layer Circuit Board with 3/3mil Line Width for High-Density Interconnect

4 Layers High Frequency PCB with Rogers +FR4 Composite for Superior High Speed Performance

8 Layers 1 Level HDI Light Board PCB with 2.0mm Thickness for High-Performance Applications