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8-Layer Half-Hole HDI PCB Module Board for High-Density Interconnect Applications

8-Layer Half-Hole HDI PCB Module Board for High-Density Interconnect Applications

8-Layer Half-Hole Module Board

PCB Manufacturing Half-Hole Module Board

8-Layer PCB Manufacturing Module Board

Place of Origin:

China

Brand Name:

GS

Model Number:

GSJ8CBKMKB

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Product Details
Highlight:

8-Layer Half-Hole Module Board

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PCB Manufacturing Half-Hole Module Board

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8-Layer PCB Manufacturing Module Board

Payment & Shipping Terms
Minimum Order Quantity
1 PCS
Price
USD+negotiable+pcs
Packaging Details
20*20*10cm
Delivery Time
5-15 days
Payment Terms
T/T
Supply Ability
1+pcs+per days
Product Description
8-Layer Half-Hole Module Board: The Perfect Solution for PCB Manufacturing
Product Overview
This advanced 8-layer half-hole module board represents the pinnacle of PCB manufacturing technology, designed to meet the most demanding requirements for complex electronic applications.
Key Features
  • 8-layer construction for high-density circuit integration
  • Half-hole technology for enhanced connectivity and reliability
  • Optimized for complex multilayer PCB applications
  • Superior signal integrity and thermal management
  • Ideal for advanced electronic systems and modules
Technical Specifications
Engineered with precision manufacturing techniques, this module board incorporates advanced via technology and optimized layer stackup to deliver exceptional performance in demanding environments.
Related Technologies & Services:
Multilayer PCB PCB Fabrication Process HDI PCB High-Density Interconnect PCB Assembly Services Flexible Circuit Boards Rigid-flex PCBs PCB Prototyping PCB Design Software Printed Circuit Board Manufacturing PCB Etching Techniques Solder Mask Application Copper Plating in PCBs PCB Layer Stackup Via Technology in PCBs Prototype PCB Manufacturing PCB Testing Methods Surface Mount Technology (SMT) Thermal Management in PCBs PCB Material Types (FR-4, Rogers) Rapid PCB Manufacturing

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