This high-performance multilayer PCB features robust construction with exceptional thickness and premium materials for demanding industrial applications.
Board Thickness: 3.0mm - Extra thick for enhanced durability and structural integrity
Layer Count: 4 layers - Optimized for complex circuit routing and signal integrity
Base Material: Shengyi TG170 sheet - High-performance laminate with excellent thermal and mechanical properties
Surface Finish: Heavy gold - Superior corrosion resistance and reliable connectivity
Technical Capabilities
Our PCB manufacturing process ensures precision and reliability for motherboard applications requiring stable performance under challenging conditions.